10M04SCE144C8G Datasheet, Pinout, Equivalents, and Specs
The 10M04SCE144C8G is a non-volatile FPGA from Intel's (formerly Altera) MAX 10 family, fabricated on a 55nm process. It integrates 4,000 logic elements, 189 Kbit of embedded SRAM, dual on-chip configuration flash, and 2 PLLs into a compact 144-pin EQFP package. Designed for cost-sensitive, instant-on embedded systems, this single-supply device eliminates the need for external configuration memory — making it a practical choice for industrial control, communications bridging, and IoT edge applications.
What Is the 10M04SCE144C8G?
The 10M04SCE144C8G belongs to the Intel MAX 10 FPGA product line — the industry's first single-chip, non-volatile FPGA family. Unlike SRAM-based FPGAs that require an external configuration flash (such as EPCQ or SPI NOR), MAX 10 devices integrate dual configuration flash memory on-die, enabling instant-on operation within milliseconds of power-up. This architecture removes an external component from the BOM and simplifies board layout.
The part number decodes as follows: 10M04 = MAX 10, 4,000 logic elements; SC = Single-supply, Compact variant (no integrated ADC); E144 = 144-pin Enhanced Quad Flat Package (EQFP); C8 = Commercial temperature (0°C to 85°C), speed grade 8; G = Pb-free / RoHS compliant. The "SC" designation specifically means this variant operates from a single 3.3V external supply — the internal 1.2V core voltage is generated by an on-chip regulator — and does not include the 12-bit ADC block found in the "SA" (analog) variants.
MAX 10 FPGAs are fully supported by Intel Quartus Prime Lite Edition, which is available at no cost and requires no license file, making this device accessible for prototyping and low-to-mid volume production.
Figure 1: Intel MAX 10 FPGA architecture overview — illustrating configurable logic blocks, embedded memory, PLL, and I/O interconnect fabric.
Pinout Configuration and Packaging
The 10M04SCE144C8G ships in a 144-pin EQFP (Enhanced Quad Flat Package) with a body size of 20 mm × 20 mm and 0.5 mm lead pitch. The package provides 101 user I/O pins organized across 8 I/O banks, supporting voltage standards including 3.3V / 2.5V / 1.8V / 1.5V LVTTL and LVCMOS, as well as differential standards like LVDS.
Key pinout considerations for PCB designers:
- VCCIO banks: Each I/O bank has independent VCCIO supply pins, allowing mixed voltage levels across banks. For the compact "SC" variant, all VCCIO pins are typically tied to 3.3V or 2.5V.
- JTAG pins (TCK, TDI, TDO, TMS): Dedicated boundary-scan and configuration pins. These must be properly terminated even if JTAG is unused in production — 10kΩ pull-ups on TDI and TMS are recommended.
- MSEL[0]: Configuration mode select pin. Tie to GND for internal configuration mode. For dual-image remote update, use the MAX 10 Remote System Upgrade (RSU) IP core.
- Power/Ground: Multiple VCC (1.2V core, internally regulated) and GND pins are distributed throughout the package. All power and ground pins must be connected — do not leave any floating.
- Exposed thermal pad: The EQFP package includes an exposed pad on the underside that must be soldered to a ground plane for thermal dissipation and electrical grounding.
Figure 2: 10M04SCE144C8G 3D package model — 144-EQFP with exposed thermal pad, 20 mm × 20 mm body, 0.5 mm pitch.
Core Architectural Features
- 4,000 Logic Elements (LEs): Each LE contains a 4-input look-up table (LUT), a programmable register, and carry chain logic. LEs are grouped into Logic Array Blocks (LABs) of 16 LEs each, with dedicated local interconnect for fast intra-LAB routing.
- 189 Kbit Embedded SRAM: 21 M9K memory blocks (each 9,216 bits including parity) configurable as single-port RAM, simple dual-port RAM, true dual-port RAM, ROM, or FIFO buffers. Supports data widths from ×1 to ×36 with byte-enable control. Operates at up to 284 MHz.
- 16 Embedded 18×18-bit Multipliers: Dedicated hardware multiplier blocks for DSP-class operations. Each block can operate as one 18×18-bit multiplier or be split into two independent 9×9-bit multipliers — suitable for FIR filters, arithmetic pipelines, and signal processing.
- 2 PLLs with 4 Output Counters Each: On-chip phase-locked loops provide clock synthesis, multiplication, division, and phase shifting. Input frequency range spans 5 MHz to 472.5 MHz with up to 4 independent output clocks per PLL, enabling multi-clock-domain designs without external oscillators.
- Dual Configuration Flash + User Flash Memory (UFM): Two on-die configuration images support fail-safe remote update via the RSU IP core. Additionally, up to 1,376 Kbit of User Flash Memory is available for non-volatile data storage — calibration coefficients, encryption keys, serial numbers, or firmware parameters.
Specifications Parameter Table
| Specification | Technical Details |
|---|---|
| Manufacturer / Family | Intel (Altera) / MAX 10 |
| Part Number | 10M04SCE144C8G |
| Logic Elements (LEs) | 4,000 |
| Embedded Memory (M9K SRAM) | 189 Kbit (21 blocks × 9 Kbit) |
| 18×18 Embedded Multipliers | 16 |
| PLLs | 2 (4 output counters each) |
| User I/O Pins (E144 package) | 101 |
| I/O Banks | 8 |
| Maximum LVDS Pairs | 15 |
| User Flash Memory (UFM) | Up to 1,376 Kbit |
| I/O Standards Supported | 3.3V/2.5V/1.8V/1.5V LVTTL & LVCMOS, LVDS, SSTL, HSTL |
| Core Voltage | 1.2V (internally regulated from 3.3V single supply) |
| External Supply Voltage | 3.3V (single rail) |
| Process Technology | 55nm (TSMC) |
| Package | 144-EQFP (20 mm × 20 mm, 0.5 mm pitch, exposed pad) |
| Temperature Range | 0°C to +85°C (Commercial) |
| Speed Grade | 8 |
| Configuration | Internal dual flash (instant-on), JTAG |
| Integrated ADC | No (Compact "SC" variant — use "SA" variant for ADC) |
| RoHS / Pb-Free | Yes ("G" suffix) |
| Lifecycle Status | Active |
10M04SCE144C8G Equivalents, Cross-Reference, and Lifecycle
The 10M04SCE144C8G is currently Active in Intel's product lifecycle and is broadly stocked by major distributors. With Intel's FPGA business now operating as Altera, engineers should monitor lifecycle bulletins for any future changes.
Pin-compatible and functional equivalents within the MAX 10 family:
- 10M04SAE144C8G — The "SA" analog variant in the same 144-EQFP package. Pin-compatible drop-in that adds an integrated 12-bit, 1 MSPS ADC with up to 9 analog input channels. Use this when on-chip analog measurement is needed without changing the PCB.
- 10M08SCE144C8G — Same package and compact variant, doubled to 8,000 logic elements with 378 Kbit embedded RAM and 36 M9K blocks. Pin-compatible upgrade path for designs that exceed the 10M04's logic capacity.
- 10M04SCE144I7G — Industrial temperature variant (-40°C to +100°C) with speed grade 7. Intended for harsh-environment deployments — automotive, military, or outdoor industrial controllers requiring extended thermal range.
Cross-vendor alternatives: The Lattice MachXO3LF-4300 offers comparable logic density (~4,300 LUTs) with integrated flash in a similar QFP package, though pin assignments differ entirely and full re-synthesis in Lattice Diamond is required. For higher-density migration, the Microchip PolarFire family provides a low-power FPGA path with flash-based non-volatile configuration.
Typical Applications and Circuit Considerations
The 10M04SCE144C8G is widely deployed in:
- Industrial control and automation: Motor drive encoder interfaces, PLC I/O expansion, sensor aggregation and protocol conversion
- Communications equipment: Protocol bridging (SPI ↔ UART, I2C ↔ parallel bus), small-cell baseband glue logic, network packet pre-processing
- Consumer and IoT edge: LED matrix display controllers, smart sensor hubs, HMI touch panel interfaces
- Board management and power sequencing: Voltage rail sequencing, system health monitoring, fan control logic, watchdog supervision
Circuit design guidelines:
- Power supply: A single 3.3V rail is required. Place 100nF ceramic decoupling capacitors on every VCC and VCCIO pin, with a bulk 10µF capacitor near the device. The on-chip regulator generates the 1.2V core supply internally.
- Configuration: Tie MSEL[0] to GND for internal configuration. The device completes configuration in under 10 ms after power-on, enabling immediate I/O control at startup.
- JTAG header: Provide a 10-pin JTAG header (TCK, TDI, TDO, TMS, TRST). Use 10kΩ pull-ups on TDI and TMS. Keep JTAG trace lengths under 150 mm.
- PCB layout: A 4-layer stackup minimum is recommended. Route clock signals on inner layers with controlled impedance (50Ω single-ended, 100Ω differential for LVDS). Minimize PLL input clock trace length and match output clock routing for skew-sensitive designs.
Figure 3: Intel MAX 10 FPGA design and programming workflow — from schematic entry through synthesis and device programming.
Video Tutorial
Market Availability and Pricing Trends
The 10M04SCE144C8G remains in active production and is stocked by major distributors including Digi-Key, Mouser, and Arrow. Post-pandemic lead times for MAX 10 devices have normalized, though certain variants may still experience periodic allocation during demand spikes. Volume pricing typically falls in the $8–$15 USD range depending on quantity and sourcing channel.
To check real-time stock, pricing, or to request a quote for the 10M04SCE144C8G and its verified alternatives, upload your BOM to WWDParts for fast processing.
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Frequently Asked Questions (FAQ)
Does the 10M04SCE144C8G include an integrated ADC?
No. The "SC" (Single-supply, Compact) variant does not include the analog-to-digital converter. For on-chip ADC functionality, use the pin-compatible 10M04SAE144C8G ("SA" = Single-supply, Analog), which provides a 12-bit, 1 MSPS ADC with up to 9 external analog input channels and an internal temperature sensor.
What software and hardware tools are needed for developing with the 10M04SCE144C8G?
Intel Quartus Prime Lite Edition (free, no license file needed) fully supports the MAX 10 family for design entry, synthesis, place-and-route, and timing analysis. For board programming and debugging, a USB-Blaster or USB-Blaster II JTAG cable is required. The Quartus package includes Platform Designer (Qsys) for system integration and ModelSim-Intel FPGA Starter Edition for functional simulation.
Can the 10M08SCE144C8G replace the 10M04SCE144C8G without PCB changes?
Yes. The 10M08SCE144C8G is fully pin-compatible in the same 144-EQFP package and doubles the logic capacity to 8,000 LEs with 378 Kbit of embedded RAM. Power consumption increases slightly under load, so verify your 3.3V supply can source the additional current. Only re-synthesis and re-programming in Quartus are required — no PCB modifications needed.
How fast does the 10M04SCE144C8G configure after power-on?
MAX 10 devices with internal configuration flash typically complete configuration and are fully operational in under 10 milliseconds after power supplies reach valid levels. This instant-on behavior is significantly faster than SRAM-based FPGAs that require external flash loading, making the 10M04SCE144C8G well-suited for applications where immediate I/O control is critical at power-up, such as power sequencing or safety interlocks.
How many user I/O pins does the 10M04SCE144C8G provide?
The 144-EQFP package variant provides 101 user I/O pins across 8 independently-powered I/O banks. All I/O pins support 3.3V LVTTL and LVCMOS standards natively. Each bank's VCCIO can be set independently, allowing mixed-voltage designs where some banks operate at 2.5V, 1.8V, or 1.5V while others remain at 3.3V. Up to 15 LVDS differential pairs are available for high-speed signaling.
Is the 10M04SCE144C8G suitable for automotive or extended-temperature applications?
The C8G variant is rated for the commercial temperature range (0°C to +85°C) only. For automotive, military, or harsh-environment applications, the 10M04SCE144I7G industrial variant supports -40°C to +100°C. For automotive-grade AEC-Q100 qualification, verify the specific device grade and qualification status directly with Intel/Altera or your authorized distributor, as not all MAX 10 variants carry automotive qualification.
Alan Carter
Senior Hardware Engineer & Component Specialist
Alan has over 15 years of expertise in embedded systems design, FPGA architecture, and global semiconductor supply chains. He specializes in component cross-referencing, lifecycle management, and helping OEMs navigate supply shortages.
