EP4CE6E22C8N Datasheet, Pinout, Equivalents, and Specs

The EP4CE6E22C8N is a Field-Programmable Gate Array (FPGA) from Intel's (formerly Altera) Cyclone IV E family, fabricated on a 60-nm low-power process technology. It is designed to provide a low-cost, low-power logic solution for high-volume, cost-sensitive applications. This component integrates a core fabric of logic elements, embedded memory, and optimized interconnects, positioning it as a versatile option for digital logic integration, interface bridging, and control functions within the Cyclone IV series.

What is the EP4CE6E22C8N?

The EP4CE6E22C8N is a specific model within the Cyclone IV E device family, characterized by its logic density of 6,272 Logic Elements (LEs). The internal architecture is based on a vertical arrangement of Logic Array Blocks (LABs), each containing multiple adaptive logic modules (ALMs). This structure is optimized for efficient implementation of combinatorial and sequential logic. The device is targeted at applications requiring flexible I/O, custom logic implementation, and parallel processing capabilities without the high power consumption of more advanced FPGA families. Engineering benefits include its ability to consolidate multiple discrete logic functions into a single chip, reduce board space, and enable rapid prototyping and in-field hardware updates through reconfiguration.

Pinout Configuration and Packaging

The EP4CE6E22C8N is offered in a 144-pin Equatorial Quad Flat Pack (EQFP) package, designated by the "E22" in the part number. This package provides a balance between pin density and ease of assembly for standard PCB manufacturing processes. The pinout includes dedicated pins for power (VCCINT, VCCIO), ground (GND), configuration (JTAG, AS), and clock inputs. The remaining pins are configurable as general-purpose I/O (GPIO) that can support a wide range of single-ended and differential signaling standards. Thermal management is a key consideration; the EQFP package includes an exposed thermal pad on the underside, which should be soldered to a corresponding copper plane on the PCB to facilitate heat dissipation from the device core.

Core Architectural Features

• Logic Elements (LEs): The device contains 6,272 LEs, which are the fundamental building blocks for implementing custom logic. Each LE is a compact unit comprising a 4-input look-up table (LUT), a full adder, and a programmable register, enabling efficient implementation of combinatorial and sequential functions.
• Embedded Memory Blocks: It integrates 270 Kbits of total RAM, organized as M9K memory blocks. These are true dual-port memory blocks that can be configured in various widths and depths (e.g., x1, x2, x4, x8, x9, x16, x18, x32, x36) to support functions like FIFOs, data buffers, and processor memory.
• Embedded Multipliers: The architecture includes 15 embedded 18x18 multiplier blocks. These dedicated hardware blocks are optimized for implementing high-performance digital signal processing (DSP) functions such as filters (FIR, IIR) and FFTs, offloading these computationally intensive tasks from the general logic fabric.
• Clock Management (PLLs): The device features 2 general-purpose Phase-Locked Loops (PLLs). These PLLs provide robust clock synthesis and management capabilities, including frequency multiplication/division, phase shifting, and clock deskewing, which are critical for meeting timing requirements in complex synchronous systems.

Specifications Parameter Table

EP4CE6E22C8N Equivalents, Cross Reference, and Lifecycle

The EP4CE6E22C8N is considered an active, mature component. While not recommended for new designs where longer product lifecycles are critical, it remains in production for existing systems. For buyers facing allocation or long lead times, identifying alternatives is essential. A direct, pin-to-pin compatible alternative is the EP4CE6E22C7N. This part is identical in package, pinout, logic density, and memory, but features a faster speed grade ('7' vs. '8'). A system designed for the EP4CE6E22C8N can typically use the EP4CE6E22C7N as a drop-in replacement, as the faster part will meet or exceed the timing requirements of the slower part. However, it is critical to note that while the hardware is pin-compatible, the FPGA configuration bitstream must be recompiled in the Quartus Prime software targeting the specific replacement part number before programming. No direct drop-in replacement exists from competing manufacturers (e.g., Xilinx/AMD, Lattice) due to proprietary architecture and configuration methods.

Typical Application & Circuit Considerations

The EP4CE6E22C8N is commonly used in industrial control systems, video and image processing equipment, automotive infotainment, and communication interface bridging. Its low power consumption makes it suitable for portable and battery-powered devices. In a typical application circuit, robust power supply decoupling is mandatory. Separate decoupling capacitors (typically 0.1µF and 10µF ceramic capacitors) must be placed as close as possible to each VCCINT and VCCIO pin-pair to ensure power supply integrity and minimize noise. For high-speed I/O signals, PCB routing should follow controlled impedance guidelines to maintain signal integrity. The configuration scheme (e.g., Active Serial, JTAG) must be selected during the design phase, requiring connections to a configuration device like an EPCS series flash memory or a JTAG header for programming and debugging.

Video Demonstration

Market Availability and Pricing Trends

As a mature component, the EP4CE6E22C8N may experience variable lead times and supply constraints based on foundry capacity and demand from legacy systems. The global semiconductor supply chain can impact availability, making proactive sourcing and verification of stock essential for production planning. To check real-time stock, pricing, or to request a quote for the EP4CE6E22C8N and its verified alternatives, upload your BOM to WWDParts for fast processing.

Alan Carter

Senior Hardware Engineer & Component Specialist

Alan has over 15 years of expertise in embedded systems design, FPGA architecture, and global semiconductor supply chains. He specializes in component cross-referencing, lifecycle management, and helping OEMs navigate supply shortages.