10M04SCE144C8G Specifications, Pinout & Design Guide

· Published by WWDParts

10M04SCE144C8G is a MAX 10 single-supply Compact FPGA. It provides 4,000 logic elements, 189 Kbit of embedded RAM and 20 dedicated 18 × 18 multipliers. This exact SC option has no integrated ADC and supports one internal configuration image. Those distinctions matter when planning sensor acquisition, firmware updates and board power.

Technical review: 8 October 2026. This guide combines manufacturer specifications with design-planning examples; the examples are not board measurements.

Specifications and ordering code

Item 10M04SCE144C8G
Logic resources 4,000 LEs; 250 LABs, with 16 LEs per LAB
Embedded RAM 189 Kbit across 21 M9K blocks
Dedicated multipliers 20 × 18 × 18-bit multipliers
Feature option SC: single-supply, Compact; no integrated ADC
Internal configuration Single configuration image; no dual-image RSU feature
User flash 128 Kbit (16 KiB) in UFM0 for this Compact option
Package E144: 144-pin EQFP; 0.5 mm lead pitch
Package I/O resources 101 GPIOs; 10 true LVDS transmitters / 41 receivers, subject to bank and placement restrictions
Temperature and speed C: commercial junction temperature 0°C to +85°C; speed grade 8
External core/periphery supply VCC_ONE: nominal 3.0 V or 3.3 V; on-die regulation supplies the internal 1.2 V rail

Resource counts: device resource table; option limits: feature-option table; package-specific I/O: MAX 10 product table; temperature: recommended operating conditions. The product table contains family maxima as well as package restrictions: an ADC or dual-image entry for the broader 10M04 family does not override the Compact option.

Keep the complete 10M04SCE144C8G code in the BOM and purchase request. Do not shorten it to 10M04 or omit the temperature, speed or final suffix. Where material compliance is required, request documentation applicable to that full ordering code and supplied lot.

Configuration, RAM and user flash are different resources

Internal configuration flash holds the FPGA design. The Compact device can self-configure from its single image, so a separate configuration-memory component is not required for that mode. It does not provide the dual-image fallback or memory-initialization modes listed for Flash and Analog options. A product requiring recoverable field updates therefore needs a programming and recovery architecture compatible with SC, or a reviewed change of device option. Compare configuration options.

For 10M04, UFM0 contains eight 16-Kbit pages and UFM1 contains zero pages: 8 × 16 Kbit = 128 Kbit = 16 KiB. Compact mode does not expose CFM1/CFM2 as extra user storage. Values such as 1,248 Kbit are mode-dependent maxima, not the available SC user-data budget. UFM/CFM array sizes; Compact memory map.

The 21 M9K blocks provide volatile working memory, separate from UFM and configuration storage. Budget FIFOs, lookup tables and processor memory individually. Select a supported width/depth and port mode in the memory IP; raw capacity alone does not establish how many application buffers will fit.

For calibration storage, reserve space for a format version, record length, integrity check and recovery policy. Flash updates need erase/program handling and interruption recovery; do not treat UFM as an unlimited-write event log. Keep the generated On-Chip Flash IP address map with the firmware interface specification.

Power, pinout and programming checks

Do not feed VCC_ONE with an external 1.2 V core rail. Connect it to the specified nominal 3.0 V or 3.3 V supply. VCCA also requires power and appropriate filtering, even if its associated functions are unused. VCCIO is selected for each bank and I/O standard; “single supply” does not mean every I/O bank is automatically 3.3 V. Banks 1B and 8 have configuration-stage supply requirements. Single-supply pin connection guidelines.

  1. Select the exact target. Set 10M04SCE144C8G in the Quartus project before assigning pins. Compare the symbol, package drawing and device pin file. A generic family diagram is not a numbered pinout.
  2. Record bank voltages. List each external signal, direction, I/O standard, bank voltage and startup state. Run assignment and placement checks before releasing the schematic.
  3. Review the programming circuit. Match JTAG voltage and wiring to the manufacturer circuit. TCK requires an external pull-down; the TDI/TMS connections and overshoot components depend on supply voltage.
  4. Keep configuration status valid. The documented circuit pulls nSTATUS high, not low; holding it low during configuration places the device in an error state. CONF_DONE and nCONFIG also require their specified connections.
  5. Release outputs deliberately. Define safe board-level states before user mode, then release functional logic only after its clocks and reset sequence are valid.

Configuration and JTAG pin requirements specify the resistor values, voltage conditions and pin-sharing behavior. Use the complete circuit for the selected configuration rather than importing MSEL, DCLK or DATA0 connections from a different FPGA family.

Choose the footprint, exposed-pad treatment, stackup and decoupling from the mechanical drawing and actual board requirements. A universal “nine thermal vias,” fixed trace length or four-layer rule does not establish signal or thermal performance. Use the compiled pin report for a final schematic-to-layout comparison.

Application planning for a 4,000-LE device

The logic fabric uses four-input LUT-based LEs, grouped in 16-LE LABs. These are not the adaptive logic modules used by some other FPGA families. LE and LAB architecture. Suitable evaluation projects include digital I/O aggregation, bus bridging, encoder capture, PWM generation and display-control logic. Each needs a resource, interface and timing budget.

Sensor aggregation and buffering

SC has no on-chip analog converter. An analog sensor path needs an external converter and its digital interface. As a planning example, four channels sampled at 100 ksample/s with 16-bit records produce 6.4 Mbit/s of payload. A 1 ms buffer holds 800 bytes, before channel tags, framing and alignment. This arithmetic helps size the FIFO and output link; it does not prove any particular ADC connection or clock rate works.

For an SPI bridge, include transaction gaps and command bytes in the link budget. For unrelated input and output clocks, use a suitable clock-domain crossing method and decide what happens when the destination stalls. Test overflow, restart and reset behavior in simulation before board testing.

DSP, soft processors and clocks

Twenty hardware multipliers can support arithmetic datapaths, but filters also consume registers, adders, control logic and memory. For example, a one-product-per-cycle, fully parallel 16-tap FIR concept uses 16 multiplications per sample; coefficient width, pipelining and synthesis mapping determine the actual fit. Sharing arithmetic changes the cycle budget.

A soft processor adds firmware storage, boot logic and peripherals as well as the CPU. Compile the chosen implementation for SC and check initialization support before allocating the remaining memory. A LE estimate for a bare processor is not a complete system budget.

For clocks, retain the exact oscillator, generated-clock constraints and timing report with the project. PLL availability is package dependent, and family clock maxima are not application Fmax guarantees. Clocking and PLL overview. Use a tool release and installed device package that include the exact target, and verify simulator and IP licensing separately.

Replacement and procurement checks

10M04SAE144C8G and 10M08SCE144C8G are candidates for evaluation, not approved drop-in replacements. Compare the feature option, exact pins and bank supplies, configuration mode, timing, power and thermal budget. Run the Quartus Pin Migration View and recompile the real design. Manufacturer migration guidance.

A commercial temperature device is not qualified for an industrial or automotive environment merely because its logic resources fit. A cross-vendor FPGA change also changes implementation tools, IP and board interfaces. Keep approval tied to the actual design revision and operating conditions.

For a quotation, send 10M04SCE144C8G, quantity, required delivery date, packaging and documentation requirements through the WWDParts RFQ page. Price, availability and delivery terms are confirmed in the individual written quotation.

Common questions

Does SC provide an ADC or two boot images?

No. Compact provides one internal configuration image and no integrated ADC. Select the appropriate option before planning analog acquisition or dual-image recovery.

Are all 101 GPIOs available to my application?

101 is the package resource count. Dedicated functions, clocks, configuration settings, bank standards and differential assignments determine the usable set in your compiled project.

Can this replace a microcontroller?

It can implement custom digital logic, and a soft-processor system may be considered after resource and boot checks. It does not automatically reproduce a microcontroller’s peripherals, analog functions or software environment.

Does instant-on mean outputs are valid immediately?

No. Power-on reset, configuration and initialization still occur. Use the exact device timing requirements and verify the board startup sequence before relying on an output.

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