10M04SCE144C8G FPGA: Datasheet, Pinout, Equivalents, and Specs

The 10M04SCE144C8G is a low-cost, single-supply FPGA from Intel's MAX 10 family, built on a 55nm process node. With 4,000 logic elements, integrated flash memory for instant-on configuration, and a compact 144-pin EQFP package, it targets cost-sensitive embedded and industrial designs where non-volatile FPGA operation is required. The device carries a commercial temperature rating (0°C to 85°C) and speed grade 8.

What Is the 10M04SCE144C8G?

The 10M04SCE144C8G belongs to Intel's (formerly Altera) MAX 10 FPGA product line — the industry's first single-chip, non-volatile FPGA family. Unlike traditional FPGAs that require an external configuration flash, MAX 10 devices integrate dual configuration flash memory on-die, enabling instant-on operation within milliseconds of power-up. This eliminates the need for a separate EPCQ or SPI flash device on the board.

The "10M04" designation indicates 4,000 logic elements. The "SC" suffix identifies this as the single-supply, compact variant — meaning it operates from a single 3.3V external supply rail (the internal 1.2V core voltage is generated by an on-chip regulator) and does not include the integrated ADC block found in the "SA" analog variants. The "E144" denotes the 144-pin Enhanced Quad Flat Package (EQFP), and "C8G" specifies commercial temperature range with speed grade 8 and Pb-free (RoHS) packaging.

MAX 10 FPGAs are supported by the Intel Quartus Prime Lite Edition, which is available at no cost, making the 10M04SCE144C8G accessible for prototyping and low-volume production without license fees.

Figure 1: MAX 10 FPGA architecture block diagram illustrating configurable logic blocks, embedded memory, and interconnect fabric.

Pinout Configuration and Packaging

The 10M04SCE144C8G is packaged in a 144-pin EQFP (Enhanced Quad Flat Package) with a body size of 20 mm × 20 mm and 0.5 mm lead pitch. This surface-mount package provides 101 user I/O pins organized across 8 I/O banks, supporting a range of I/O standards including LVTTL, LVCMOS (3.3V, 2.5V, 1.8V, 1.5V), and differential I/O standards such as LVDS.

Key pinout considerations for PCB design:

• VCCIO banks: Each I/O bank has independent VCCIO supply pins, allowing different voltage levels on different banks. For the compact variant, all VCCIO pins are typically tied to 3.3V or 2.5V.
• JTAG pins (TCK, TDI, TDO, TMS): Dedicated pins for boundary-scan testing and FPGA configuration. These must be properly terminated even if JTAG is not used in production.
• Configuration pins: MSEL[0] pin determines the configuration scheme (JTAG or Internal Configuration). For internal configuration, MSEL[0] should be tied to GND.
• Power/Ground: Multiple VCC (1.2V core) and GND pins are distributed throughout the package. All must be connected for reliable operation — do not leave any power or ground pins floating.
• Thermal pad: The EQFP package includes an exposed thermal pad on the underside that should be soldered to a ground plane for thermal dissipation.

Figure 2: 10M04SCE144C8G in 144-EQFP package — physical component showing pin layout and package markings.

Core Architectural Features

• 4,000 Logic Elements (LEs): Each LE contains a 4-input look-up table (LUT), a programmable register, and carry chain logic. LEs are grouped into Logic Array Blocks (LABs) of 16 LEs each, with dedicated local interconnect for high-speed intra-LAB routing.
• 189 Kbit Embedded SRAM: 21 M9K memory blocks (each 9,216 bits) configurable as single-port RAM, dual-port RAM, ROM, or FIFO buffers. Supports data widths from ×1 to ×36 with optional byte-enable and ECC parity.
• 16 Embedded Multipliers: 18×18-bit hardware multiplier blocks for DSP-class operations. These can be split into two independent 9×9 multipliers or used in full 18×18 mode for filter and arithmetic-intensive applications.
• 2 PLLs with 4 Output Counters Each: On-chip phase-locked loops provide clock multiplication, division, and phase shifting. Input frequency range of 5 MHz to 472.5 MHz with up to 4 independent output clocks per PLL — enabling complex multi-clock-domain designs without external oscillators.
• Dual Configuration Flash + User Flash Memory (UFM): On-die flash provides two configuration images for fail-safe remote update. Additionally, up to 1,376 Kbit of User Flash Memory is available for non-volatile data storage (calibration data, encryption keys, serial numbers).

Specifications Parameter Table

10M04SCE144C8G Equivalents, Cross-Reference, and Lifecycle

The 10M04SCE144C8G is currently listed as Active in Intel's product lifecycle, with broad distribution through major authorized channels. However, given Intel's announced divestiture of its FPGA business (now Altera), engineers should monitor lifecycle notices for potential changes.

Pin-compatible and functional equivalents:

• 10M04SAE144C8G — The "SA" analog variant in the same 144-EQFP package. It is pin-compatible and adds an integrated 12-bit, 1 MSPS ADC with up to 9 analog input channels. This is a direct drop-in upgrade if analog measurement capability is needed.
• 10M08SCE144C8G — Same package, same compact variant, but with 8,000 logic elements (double the LEs), 378 Kbit embedded RAM, and 36 M9K blocks. Pin-compatible upgrade path for designs that outgrow the 10M04's capacity.
• 10M04SCE144I7G — Industrial temperature variant (-40°C to 100°C) of the same device, with speed grade 7. Use this for automotive, military, or harsh-environment deployments requiring extended temperature range.

For designers seeking cross-vendor alternatives, the Lattice MachXO3LF-4300 offers similar logic density (~4,300 LUTs) with integrated flash in a comparable QFP package, though pin assignments differ and a full re-synthesis is required. The Microchip PolarFire family offers a migration path for higher-density requirements.

Typical Applications and Circuit Considerations

The 10M04SCE144C8G is widely used in:

• Industrial control and automation: Motor drive encoders, PLC I/O expansion, sensor aggregation
• Communications equipment: Protocol bridging (SPI-to-UART, I2C-to-parallel), small-cell baseband glue logic
• Consumer and IoT edge devices: LED display controllers, smart sensor hubs, HMI interfaces
• Board management controllers: Power sequencing, voltage monitoring, system health reporting

Circuit design guidelines:

• Power supply: A single 3.3V rail is required. Place 100nF decoupling capacitors on every VCC and VCCIO pin, plus a bulk 10µF capacitor near the device. The on-chip voltage regulator generates the 1.2V core supply — no external 1.2V regulator is needed.
• Configuration: Tie MSEL[0] to GND for internal configuration. For dual-image remote update, use the MAX 10 Remote System Upgrade (RSU) IP core to manage fail-safe image switching.
• JTAG: Provide a 10-pin JTAG header connected to TCK, TDI, TDO, TMS, and TRST (optional). A 10kΩ pull-up on TDI and TMS is recommended.
• PCB layout: Use a 4-layer stackup minimum. Route all clock signals on inner layers with controlled impedance (50Ω single-ended, 100Ω differential for LVDS). Place the PLL input clock trace as short as possible with matched-length output clock routing.

Figure 3: Typical FPGA design flow from RTL synthesis through programming — applicable to 10M04SCE144C8G development with Intel Quartus Prime.

Video Tutorial

Market Availability and Pricing Trends

The 10M04SCE144C8G remains in active production and is stocked by major distributors including Digi-Key, Mouser, and Arrow. Lead times for MAX 10 devices have normalized following the post-pandemic semiconductor shortage, though specific variants may still experience periodic allocation. Pricing typically ranges in the $8–$15 USD bracket for volume orders depending on speed grade and temperature variant.

To check real-time stock, pricing, or to request a quote for the 10M04SCE144C8G and its verified alternatives, upload your BOM to WWDParts for fast processing.

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Frequently Asked Questions (FAQ)

Alan Carter

Senior Hardware Engineer & Component Specialist

Alan has over 15 years of expertise in embedded systems design, FPGA architecture, and global semiconductor supply chains. He specializes in component cross-referencing, lifecycle management, and helping OEMs navigate supply shortages.