10M04SCE144C8G Datasheet, Pinout, Block Diagram & Application Guide
The 10M04SCE144C8G is a non-volatile FPGA from Intel's (formerly Altera) MAX 10 family, built on TSMC's 55nm flash-based process. It packs 4,000 logic elements, 189 Kbit of M9K embedded SRAM, 16 hardware 18×18 multipliers, dual on-chip configuration flash, and 2 PLLs into a compact 144-pin EQFP package. As an instant-on, single-supply device that eliminates external configuration memory, the 10M04SCE144C8G targets cost-sensitive embedded systems in industrial control, communications bridging, and IoT edge applications.
Overview and Part Number Decoding
The 10M04SCE144C8G belongs to the Intel MAX 10 product line — the industry's first single-chip, non-volatile FPGA family. Unlike SRAM-based FPGAs (Xilinx Spartan, Intel Cyclone) that require external SPI flash for configuration, MAX 10 devices store two configuration images in on-die flash, enabling instant-on operation within milliseconds of power-up. This removes the external EPCQ/SPI NOR from the BOM, saving both cost and board area.
The part number decodes as follows:
- 10M04 — MAX 10 family, 4,000 logic elements
- SC — Single-supply, Compact variant (no integrated ADC block)
- E144 — 144-pin Enhanced Quad Flat Package (EQFP)
- C8 — Commercial temperature range (0°C to 85°C), speed grade 8
- G — RoHS / Pb-free compliant
The "SC" designation means this variant operates from a single 3.3V external supply — the internal 1.2V core voltage is generated by an on-chip linear regulator — and does not include the 12-bit SAR ADC found in the "SA" (analog) variants. MAX 10 FPGAs are fully supported by Intel Quartus Prime Lite Edition, available at no cost and requiring no license file.
Specifications and Parameter Table
| Parameter | Value |
|---|---|
| Manufacturer | Intel (Altera) |
| Product Family | MAX 10 |
| Part Number | 10M04SCE144C8G |
| Logic Elements (LEs) | 4,000 |
| Logic Array Blocks (LABs) | 250 (16 LEs per LAB) |
| M9K Embedded Memory Blocks | 21 |
| Total Embedded SRAM | 189 Kbit |
| 18×18 Embedded Multipliers | 16 |
| Phase-Locked Loops (PLLs) | 2 (4 output counters each) |
| User Flash Memory (UFM) | 1,376 Kbit |
| User I/O Pins (E144 package) | 101 |
| I/O Banks | 8 |
| Maximum LVDS Differential Pairs | 15 |
| I/O Standards | 3.3V/2.5V/1.8V/1.5V LVTTL/LVCMOS, LVDS, SSTL, HSTL |
| Maximum Clock Frequency | 402 MHz |
| M9K Maximum Speed | 284 MHz |
| Core Voltage (VCC) | 1.2V (internally regulated) |
| External Supply (VCCA/VCCIO) | 3.3V single rail |
| Process Technology | 55nm (TSMC) |
| Package | 144-EQFP (20×20 mm, 0.5 mm pitch, exposed pad) |
| Temperature Range | 0°C to +85°C (Commercial) |
| Speed Grade | 8 |
| Configuration | Internal dual flash (instant-on), JTAG |
| Integrated ADC | No ("SC" Compact variant) |
| RoHS Compliant | Yes |
| Lifecycle Status | Active |
Architecture and Block Diagram
The MAX 10 FPGA architecture is organized around a fabric of configurable logic, embedded memory, and DSP resources interconnected by a hierarchical routing network. The 10M04SCE144C8G integrates the following core building blocks:
- 4,000 Logic Elements (LEs): Each LE contains a 4-input look-up table (LUT), a programmable register with synchronous load and asynchronous clear, carry chain logic, and register feedback. LEs are grouped into 250 Logic Array Blocks (LABs) of 16 LEs each, with dedicated local interconnect for fast intra-LAB routing.
- 21 M9K Memory Blocks (189 Kbit): Each 9,216-bit block (including parity) is configurable as single-port RAM, simple dual-port RAM, true dual-port RAM, ROM, or FIFO buffer. Supports data widths from ×1 to ×36 with byte-enable control, operating at up to 284 MHz.
- 16 Embedded 18×18-bit Multipliers: Dedicated hardware DSP blocks for arithmetic operations. Each block operates as one 18×18-bit multiplier or splits into two independent 9×9-bit multipliers — suitable for FIR filters, arithmetic pipelines, and motor control algorithms.
- 2 PLLs: On-chip phase-locked loops provide clock synthesis, multiplication (up to ×512), division, and phase shifting. Input frequency range spans 5 MHz to 472.5 MHz with up to 4 independent output clocks per PLL.
- Dual Configuration Flash + UFM: Two on-die configuration images enable fail-safe remote update via the Remote System Upgrade (RSU) IP core. Additionally, 1,376 Kbit of User Flash Memory stores calibration data, serial numbers, encryption keys, or firmware parameters non-volatilely.
Figure 1: Intel MAX 10 FPGA architecture block diagram — configurable logic fabric, embedded memory columns, PLL, DSP blocks, and user I/O ring.
Pinout, Package, and PCB Layout
The 10M04SCE144C8G ships in a 144-pin EQFP (Enhanced Quad Flat Package) with a body size of 20 mm × 20 mm and 0.5 mm lead pitch. The package provides 101 user I/O pins organized across 8 I/O banks, each with independent VCCIO supply for mixed-voltage designs.
Key pinout considerations for PCB layout:
- VCCIO Banks: Each I/O bank has independent VCCIO pins. For the "SC" single-supply variant, all VCCIO pins are typically tied to 3.3V. Mixed-voltage designs can set individual banks to 2.5V, 1.8V, or 1.5V.
- JTAG Pins (TCK, TDI, TDO, TMS): Dedicated configuration and boundary-scan pins. Apply 10kΩ pull-ups on TDI and TMS, even if JTAG is unused in production.
- MSEL[0]: Configuration mode select. Tie to GND for internal configuration mode.
- Power/Ground: All VCC and GND pins must be connected. Place 100nF MLCC decoupling capacitors on every power pin, plus a 10µF bulk capacitor near the device.
- Exposed Thermal Pad: The bottom-side pad must be soldered to a continuous ground plane for thermal dissipation and electrical grounding. Use at least 9 thermal vias (0.3mm drill) under the pad.
Figure 2: 10M04SCE144C8G schematic symbol — 144-EQFP pin assignments showing I/O banks, dedicated power pins, JTAG interface, and configuration signals.
Application Circuits and Design Guidelines
The 10M04SCE144C8G is widely deployed in systems requiring instant-on programmable logic with a low component count:
- Industrial Control: Motor drive encoder interfaces, PLC I/O expansion, sensor aggregation, and protocol conversion (SPI ↔ UART, I2C ↔ parallel bus)
- Communications Equipment: Small-cell baseband glue logic, Ethernet packet pre-processing, CPRI/OBSAI framing
- Board Management: Voltage rail sequencing, system health monitoring, fan control, watchdog supervision
- Consumer and IoT Edge: LED matrix display controllers, smart sensor hubs, HMI panel interfaces
Power Supply Design: The "SC" variant requires a single 3.3V rail. Texas Instruments reference design TIDA-00607 demonstrates a complete power solution using the TPS65218 PMIC, providing all required rails (1.2V core + 2.5V/3.3V I/O) from a single 5V or Li-Ion battery input in under 1,594 mm² total board area. For a more compact solution, the TIDA-01366 uses three discrete DC/DC converters achieving 92% efficiency at half load in under 300 mm².
PCB Layout Best Practices:
- Use a 4-layer minimum stackup with dedicated power and ground planes
- Route clock signals on inner layers with 50Ω controlled impedance (100Ω differential for LVDS)
- Keep PLL input clock traces under 50mm with matched-length output clock routing
- Provide a 10-pin JTAG header with trace lengths under 150mm
- Tie MSEL[0] to GND for internal configuration; device completes configuration in under 10 ms
Figure 3: 10M04SCE144C8G PCB footprint — 144-EQFP land pattern with exposed thermal pad, suitable for reflow soldering.
Equivalents, Cross-Reference, and Lifecycle
The 10M04SCE144C8G is currently Active in Intel's product lifecycle and is broadly stocked by major distributors including Digi-Key, Mouser, and Arrow.
Pin-compatible alternatives within the MAX 10 family:
- 10M04SAE144C8G — The "SA" analog variant in the same 144-EQFP package. Pin-compatible drop-in that adds an integrated 12-bit, 1 MSPS SAR ADC with up to 9 analog channels. No PCB change required.
- 10M08SCE144C8G — Same package, doubled to 8,000 LEs with 378 Kbit embedded RAM and 36 M9K blocks. Pin-compatible logic capacity upgrade.
- 10M04SCE144I7G — Industrial temperature variant (-40°C to +100°C), speed grade 7. For harsh-environment and automotive deployments.
Cross-vendor alternatives:
- Lattice MachXO3LF-4300 — Comparable logic density (~4,300 LUTs) with integrated flash in a QFP package. Requires full re-synthesis in Lattice Diamond; pinout is not compatible.
- Microchip PolarFire MPF100T — Higher-density, low-power flash-based FPGA for migration when design outgrows MAX 10 capacity.
Volume pricing for the 10M04SCE144C8G typically falls in the $8–$15 USD range depending on quantity and distribution channel. Post-pandemic lead times have normalized, though periodic allocation may occur during demand spikes.
To check real-time stock, pricing, or to request a quote for the 10M04SCE144C8G and verified alternatives, upload your BOM to WWDParts for fast processing.
Video Tutorial
Video: Getting started with Intel FPGA development using Quartus Prime — applicable to the MAX 10 10M04SCE144C8G.
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Frequently Asked Questions (FAQ)
Does the 10M04SCE144C8G include an integrated ADC?
No. The "SC" (Single-supply, Compact) variant does not include the analog-to-digital converter. For on-chip ADC functionality, use the pin-compatible 10M04SAE144C8G ("SA" variant), which provides a 12-bit, 1 MSPS SAR ADC with up to 9 external analog channels and an internal temperature sensor.
What development tools are needed for the 10M04SCE144C8G?
Quartus Prime Lite Edition (free, no license required) fully supports MAX 10 for design entry, synthesis, place-and-route, and timing analysis. A USB-Blaster or USB-Blaster II JTAG cable is needed for programming and debugging. The Quartus package includes Platform Designer (Qsys) for system integration and ModelSim-Intel FPGA Starter Edition for simulation.
Can the 10M08SCE144C8G replace the 10M04SCE144C8G without PCB changes?
Yes. The 10M08SCE144C8G is fully pin-compatible in the same 144-EQFP package and doubles the logic capacity to 8,000 LEs with 378 Kbit of embedded RAM. Power consumption increases slightly under load, so verify your 3.3V supply has adequate current margin. Only re-synthesis and re-programming are required.
How fast does the 10M04SCE144C8G boot after power-on?
MAX 10 devices with internal configuration flash complete initialization and become fully operational in under 10 milliseconds after supplies reach valid levels. This instant-on capability is critical for power sequencing, safety interlocks, and any application where I/O must be deterministic immediately at startup.
What is the maximum operating frequency of the 10M04SCE144C8G?
The logic fabric supports clock frequencies up to 402 MHz for register-to-register paths (speed grade 8). The M9K embedded memory blocks operate at up to 284 MHz. Actual achievable frequency depends on design complexity, routing congestion, and timing constraints set in Quartus Prime.
Is the 10M04SCE144C8G suitable for automotive or extreme-temperature environments?
The C8G variant is rated for the commercial range (0°C to +85°C). For extended temperature requirements, use the 10M04SCE144I7G industrial variant (-40°C to +100°C). For AEC-Q100 automotive qualification, confirm the specific device grade and qualification status with Intel/Altera or your authorized distributor.
Alan Carter
Senior Hardware Engineer & Component Specialist
Alan has over 15 years of expertise in embedded systems design, FPGA architecture, and global semiconductor supply chains.
