10M16SAU169I7G Datasheet, Specifications & Application Guide | Altera MAX 10 FPGA

10M16SAU169I7G Datasheet, Specifications & Application Guide | Altera MAX 10 FPGA

The 10M16SAU169I7G is a non-volatile FPGA from the Altera (Intel) MAX 10 family, built on a 55 nm flash process. With 16,000 logic elements, an integrated dual 12-bit ADC, embedded SRAM, user flash memory, and instant-on capability, it delivers a highly integrated single-chip solution for industrial, IoT, and mixed-signal embedded designs. This guide covers its complete datasheet specifications, pinout, block diagram, typical application circuits, and practical design recommendations.

1. Device Overview & Part Number Decoding

The MAX 10 FPGA family eliminates external configuration devices by storing the bitstream in on-chip flash memory, enabling instant-on operation in under 10 ms. The 10M16SAU169I7G variant is optimized for single-supply, analog-enabled applications in the industrial temperature range.

Part Number Breakdown

Segment Value Meaning
10M16 MAX 10, 16K LEs Device family and logic density
S Single supply Single 3.3 V power supply for core and I/O
A Analog Integrated dual ADC enabled
U169 UBGA-169 169-ball Ultra-Fine-Pitch BGA package
I Industrial -40 C to +100 C operating range
7 Speed grade 7 Slowest speed grade (lowest power)
G Lead-free RoHS-compliant, green package

2. Key Specifications & Parameters

Parameter Value
Logic Elements (LEs) 16,000
Logic Array Blocks (LABs) 1,000
Embedded Memory (M9K SRAM) 549 Kb (56 M9K blocks)
User Flash Memory (UFM) 2,304 Kb
18 x 18 Multipliers 45
PLLs 4
Global Clock Networks 20
Max User I/O Pins (U169) 130
ADC Dual 12-bit, up to 1 MSPS, 18 analog inputs
Configuration Flash Dual-image internal flash
Core Voltage 1.2 V
I/O Supply Voltage 3.0 V / 3.3 V
I/O Standards LVTTL, LVCMOS (1.2-3.3 V), SSTL, HSTL, LVDS
Package 169-ball UBGA (11 x 11 mm, 0.8 mm pitch)
Operating Temperature -40 C to +100 C (Industrial)
Speed Grade 7
Process Technology 55 nm flash

3. Block Diagram & Architecture

The MAX 10 architecture integrates logic elements, embedded M9K memory blocks, DSP multipliers, PLLs, a dual ADC block, user flash memory, and configuration flash into a single monolithic die. The block diagram below illustrates the high-level internal architecture:

10M16SAU169I7G MAX 10 FPGA block diagram showing logic array, embedded memory, DSP, PLL, ADC and flash blocks

Key architectural highlights include:

  • Logic Array: 16,000 LEs organized into 1,000 LABs, each containing 16 adaptive logic modules (ALMs) for efficient logic mapping.
  • Embedded Memory: 56 M9K blocks providing 549 Kb of dual-port SRAM, configurable as ROM, single-port RAM, dual-port RAM, or FIFO buffers.
  • DSP Blocks: 45 embedded 18 x 18 multipliers supporting multiply-accumulate operations for digital signal processing.
  • Integrated ADC: Dual 12-bit successive-approximation ADC with up to 18 external analog inputs and an internal temperature sensor.
  • Clock Management: 4 PLLs with up to 20 global clock networks for flexible clock generation and distribution.

4. Pinout & Package Information

The 10M16SAU169I7G is packaged in a 169-ball UBGA measuring 11 x 11 mm with a 0.8 mm ball pitch. It provides up to 130 user I/O pins across multiple I/O banks supporting a wide range of voltage standards from 1.2 V to 3.3 V.

10M16SAU169I7G 169-ball UBGA package photo showing BGA ball array and chip markings

Pin assignment considerations for the U169 package:

  • Power Pins: Dedicated VCC (1.2 V core), VCCIO (per-bank, 1.2-3.3 V), and GND pins distributed across the ball array for low-impedance power delivery.
  • Configuration Pins: JTAG (TCK, TDI, TDO, TMS) for programming and debug; nCONFIG, nSTATUS, CONF_DONE for configuration control.
  • ADC Inputs: Dedicated analog input pins (ANAIN1-ANAIN18) shared with digital I/O on selected pins; REFGND and VREF for ADC reference.
  • Clock Inputs: Dedicated CLK pins for each PLL; global clock inputs distributed to all quadrants.

5. Application Circuits & Design Guide

The 10M16SAU169I7G is widely used in industrial control, motor drives, sensor hubs, IoT edge gateways, video pre-processing, and medical instrumentation. Its integrated ADC and instant-on capability make it ideal for mixed-signal embedded systems that need to be operational immediately at power-up.

10M16SAU169I7G circuit symbol and pin diagram for schematic integration

Typical Application: Industrial Sensor Hub

A common design pattern uses the 10M16SAU169I7G as a sensor fusion hub. The integrated ADC samples analog sensors (temperature, pressure, current) while the FPGA fabric implements digital filtering, protocol conversion (SPI/I2C to Ethernet or UART), and local decision logic. The dual configuration flash enables safe over-the-air firmware updates in deployed field equipment.

Power Supply Recommendations

  • VCC (1.2 V core): Use a low-noise LDO or DC-DC converter with output capacitance per the Power Management section of the MAX 10 datasheet.
  • VCCIO (3.3 V): In single-supply mode, all I/O banks are powered at 3.3 V. Decouple each VCCIO pin with 100 nF ceramic capacitors placed as close to the BGA pads as possible.
  • VCCA_ADC: Provide a clean, filtered 2.5 V supply for the ADC analog circuitry to minimize noise coupling.

Design Resources

Intel Quartus Prime Lite Edition (free) fully supports the 10M16SAU169I7G. Popular development boards include the Terasic DE10-Lite and Arrow MAX1000, both of which feature MAX 10 FPGAs with USB-Blaster programming, onboard memory, and expansion headers for rapid prototyping.

Video Tutorial

Watch this getting-started tutorial for Intel MAX 10 FPGA development with Quartus Prime:

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6. Frequently Asked Questions

Q1: What is the 10M16SAU169I7G?

The 10M16SAU169I7G is a non-volatile FPGA from the Intel (Altera) MAX 10 family. It integrates 16,000 logic elements, a dual 12-bit ADC, 549 Kb embedded SRAM, 2,304 Kb user flash memory, and 45 DSP multipliers in a compact 169-ball UBGA package rated for the industrial temperature range (-40 C to +100 C).

Q2: What package does the 10M16SAU169I7G use?

It is housed in a 169-ball Ultra-Fine-Pitch BGA (UBGA) package measuring approximately 11 x 11 mm with a 0.8 mm ball pitch, making it well-suited for space-constrained embedded designs.

Q3: Does the 10M16SAU169I7G have an integrated ADC?

Yes. The device includes a dual-channel 12-bit successive-approximation ADC capable of up to 1 MSPS, with up to 18 analog input channels. This eliminates the need for an external ADC in many mixed-signal applications.

Q4: What is the operating temperature range?

The 10M16SAU169I7G is rated for the industrial temperature range: -40 C to +100 C junction temperature, suitable for harsh-environment deployments in factory automation, outdoor IoT gateways, and automotive-adjacent systems.

Q5: What software is needed to program the 10M16SAU169I7G?

Intel Quartus Prime Lite Edition (free) fully supports all MAX 10 devices including the 10M16SAU169I7G. It provides synthesis, place-and-route, timing analysis, and JTAG programming via USB-Blaster.

Q6: Can the 10M16SAU169I7G be used for remote system updates?

Yes. MAX 10 FPGAs feature dual configuration flash memory, enabling a factory-safe image alongside an application image. This allows secure remote firmware updates with automatic fallback to the factory image if the update fails.