10M08SAE144C8G Datasheet, Pinout, Specifications & Application Guide | Intel MAX 10 FPGA

10M08SAE144C8G Datasheet, Pinout, Specifications & Application Guide | Intel MAX 10 FPGA

Overview of the 10M08SAE144C8G

The 10M08SAE144C8G is a non-volatile FPGA from Intel's (formerly Altera) MAX 10 family. Fabricated on a 55nm flash-based process, this device integrates 8,000 logic elements with an on-chip 12-bit analog-to-digital converter (ADC) and internal dual-image configuration flash memory. The "SA" designation indicates a single-supply analog variant, meaning it operates from a single 3.3V power rail while providing integrated analog functionality — a significant advantage for mixed-signal designs.

The MAX 10 family bridges the gap between CPLDs and FPGAs by combining the non-volatile, instant-on characteristics of CPLDs with the logic density, flexible I/O, and embedded memory of FPGAs. The 10M08SAE144C8G supports dual configuration images for remote field updates with fail-safe fallback, enabling safe over-the-air (OTA) updates in deployed systems.

Typical applications include industrial sensor hubs, motor control, communications protocol bridging, automotive infotainment subsystems, medical instrumentation front-ends, and power management controllers. The integrated ADC eliminates the need for external analog-to-digital converters in many designs. Development is supported by Intel Quartus Prime Lite Edition (free), providing a complete RTL-to-bitstream flow.

Key Specifications and Parameters

Parameter Value
Manufacturer Intel (formerly Altera)
Family MAX 10
Part Number 10M08SAE144C8G
Logic Elements (LEs) 8,000
Logic Array Blocks (LABs) 500
M9K Memory Blocks 32 (378 Kb total)
Total RAM Bits 387,072
18×18 Embedded Multipliers 24
Phase-Locked Loops (PLLs) 2
Global Clock Networks 20
User I/O Pins (E144) 101
Maximum LVDS Pairs 15
User Flash Memory (UFM) 32 Kb
Internal Configuration Flash Yes (dual-image CFM)
ADC Blocks 1 × 12-bit, 1 MSPS (SA = Single-supply Analog variant)
ADC Channels Up to 18 single-ended external inputs
On-chip Temperature Sensor Yes
Package Type 144-EQFP (20 × 20 mm, 0.5 mm pitch)
Core Supply Voltage 1.2V (internally regulated from 3.3V)
I/O Supply Voltage 2.85V – 3.465V (single 3.3V supply)
Speed Grade 8 (C8 = commercial, speed grade 8)
Operating Temperature 0°C to 85°C (commercial)
Process Technology 55 nm flash-based
Built-in Oscillator 116 MHz internal oscillator
RoHS Compliance Yes (G = Green/Lead-Free)
Product Status Active

The part number decodes as: 10M08 (MAX 10 family, 8K LEs), SA (Single-supply, Analog — with integrated 12-bit ADC), E144 (EQFP 144-pin package), C8 (commercial temperature, speed grade 8), G (Green/RoHS-compliant). The single-supply analog variant integrates an internal 1.2V voltage regulator so the entire device can be powered from a single 3.3V rail, greatly simplifying power supply design.

Block Diagram and Architecture

The MAX 10 architecture in the 10M08SAE144C8G employs a column-based layout with logic array blocks (LABs), M9K embedded memory columns, 18×18 multiplier blocks, PLLs, an integrated ADC, and I/O elements arranged around the device perimeter. The internal configuration flash memory (CFM) and user flash memory (UFM) are embedded directly within the FPGA fabric.

10M08SAE144C8G Intel MAX 10 FPGA block diagram showing internal architecture with LABs, M9K memory, multipliers, PLLs, ADC, flash memory, and I/O banks

Key architectural highlights of the 10M08SAE144C8G include:

  • Logic Elements (LEs): Each of the 8,000 LEs contains a four-input look-up table (LUT), a programmable register, and carry chain logic. LEs are grouped into 500 LABs of 16 LEs each for efficient local routing.
  • M9K Memory Blocks: 32 blocks provide 378 Kb of true dual-port SRAM, configurable as RAM, ROM, FIFO, or shift register in various width/depth combinations up to 256×36 bits.
  • Integrated 12-bit ADC: The on-chip ADC supports up to 18 single-ended external analog inputs with a cumulative sampling rate of 1 MSPS, along with an internal temperature sensor for thermal monitoring. This eliminates the need for external ADC chips in many mixed-signal applications.
  • Configuration Flash Memory (CFM): Supports dual compressed images for remote update with automatic fallback to the factory image if the application image fails.
  • User Flash Memory (UFM): 32 Kb of on-chip non-volatile storage accessible via Avalon Memory-Mapped interface for storing calibration data, serial numbers, or small lookup tables.

Pinout and Package Information

The 10M08SAE144C8G is packaged in a 144-pin Enhanced Quad Flat Package (EQFP) with exposed thermal pad, measuring 20mm × 20mm with 0.5mm lead pitch. The E144 package provides 101 user-programmable I/O pins organized across eight I/O banks supporting voltage standards from 1.2V to 3.3V.

10M08SAE144C8G Intel MAX 10 FPGA 144-EQFP package photo showing the QFP IC component with 144 pin leads

The I/O banks support multiple single-ended standards including 3.3V/2.5V/1.8V/1.5V/1.2V LVCMOS and LVTTL, as well as differential standards such as LVDS with up to 15 differential pairs for high-speed serial interfaces. Each I/O pin features programmable drive strength, slew rate control, and optional internal pull-up resistors. Dedicated ADC input pins (ANAIN1–ANAIN8) are available for direct connection to analog sensors.

For complete pin assignment tables, bank assignments, and recommended PCB footprints, refer to the official Intel MAX 10 FPGA Device Handbook.

Application Circuit and Design Guide

The 10M08SAE144C8G is widely used in industrial control, communications equipment, consumer electronics, automotive subsystems, and medical instrumentation. Its non-volatile instant-on behavior, integrated ADC, and compact EQFP package make it especially popular for mixed-signal sensor hubs, motor control with analog feedback, and IoT edge devices requiring analog sensing.

Intel MAX 10 FPGA 10M08 evaluation kit development board for prototyping embedded and mixed-signal application circuits

When designing with the 10M08SAE144C8G, follow these guidelines:

  • Power Supply Design: The single-supply SA variant integrates an internal voltage regulator, requiring only a 3.3V ±5% input rail. Place 100nF + 10µF decoupling capacitors near each VCC pin pair. The analog supply (VCCADC) should be filtered separately with a ferrite bead and 10µF + 100nF capacitor network for best ADC performance.
  • ADC Input Conditioning: The integrated ADC accepts 0–2.5V input range. Use a simple resistive voltage divider with a 100nF anti-aliasing filter capacitor when interfacing 3.3V or 5V sensors. The on-chip temperature sensor requires no external components.
  • Configuration: The internal CFM stores the bitstream — no external configuration memory is needed. Program via JTAG using an Intel USB Blaster or compatible programmer. Enable dual-image mode in Quartus Prime for field-updatable designs with fail-safe fallback.
  • PCB Layout: The exposed pad on the bottom of the EQFP package must be soldered to the ground plane for electrical and thermal performance. Use a 4-layer minimum PCB stackup with dedicated ground and power planes. Route analog input traces away from digital switching signals.
  • Clock Design: Connect a 3.3V LVCMOS oscillator (typically 50 MHz) to a dedicated clock input pin. The two on-chip PLLs provide frequency synthesis from 5 MHz to 472.5 MHz output. The 116 MHz internal oscillator can serve as a system clock source for reduced component count.

The 10M16SAU169C8G provides a pin-compatible upgrade path with 16,000 logic elements for designs that require additional capacity. For industrial-temperature applications, consider the 10M16SAU169I7G with −40°C to +100°C operating range. Browse our full FPGA and CPLD catalog for additional Intel MAX 10 and Altera FPGA options.

Video Tutorial: Getting Started with Intel MAX 10 FPGA

Frequently Asked Questions

What is the 10M08SAE144C8G and what family does it belong to?

The 10M08SAE144C8G is a non-volatile FPGA from Intel's MAX 10 family. It features 8,000 logic elements, 378 Kb of M9K embedded memory, 24 embedded 18×18 multipliers, an integrated 12-bit ADC, and 101 user I/O pins in a 144-EQFP package. Built on 55nm flash-based process technology, it integrates internal configuration memory for instant-on operation without an external boot ROM.

What does the "SA" in 10M08SAE144C8G stand for?

The "SA" designation stands for Single-supply Analog. This means the device includes an integrated 12-bit ADC with up to 18 single-ended analog input channels and a built-in temperature sensor. The single-supply aspect means the device contains an internal 1.2V voltage regulator, allowing the entire FPGA to be powered from a single 3.3V rail — simplifying power supply design compared to multi-rail FPGA variants.

Does the 10M08SAE144C8G require an external configuration memory?

No. The 10M08SAE144C8G integrates on-chip configuration flash memory (CFM) that stores the FPGA bitstream internally. This provides instant-on operation — the FPGA configures itself within milliseconds at power-up without requiring any external EPCS, EPCQ, or other configuration PROM. The dual-image CFM supports a factory image and an application image for safe remote updates with automatic fallback.

What is the ADC specification of the 10M08SAE144C8G?

The 10M08SAE144C8G integrates a single 12-bit successive-approximation ADC block capable of 1 million samples per second (MSPS). It supports up to 18 single-ended external analog input channels with a 0V to 2.5V input range. The ADC also includes an on-chip temperature sensor for junction temperature monitoring. The ADC is configured and accessed through the Quartus Prime ADC IP core via an Avalon Memory-Mapped interface.

What development tools are needed for the 10M08SAE144C8G?

The 10M08SAE144C8G is fully supported by Intel Quartus Prime Lite Edition, which is available as a free download. Quartus Prime Lite includes synthesis, place-and-route, timing analysis, Signal Tap embedded logic analyzer, Platform Designer (formerly Qsys) for system integration, and the ModelSim-Intel FPGA Starter Edition for simulation. An Intel USB Blaster or USB Blaster II cable is recommended for JTAG programming. The MAX 10 FPGA 10M08 Evaluation Kit (EK-10M08E144) is available for prototyping.

How does the 10M08SAE144C8G compare to the 10M04SCE144C8G?

The 10M08SAE144C8G offers twice the logic density (8,000 vs. 4,000 LEs), more M9K memory blocks (32 vs. 21, providing 378 Kb vs. 189 Kb), additional multipliers (24 vs. 16), and an integrated 12-bit ADC that the 10M04SCE144C8G (SC = Compact, no ADC) lacks. Both devices share the same 144-EQFP package and 101 user I/O pins, making the 10M08SAE144C8G a drop-in upgrade for designs that need more resources or analog sensing capability.