10M08SAE144C8G Datasheet, Pinout, Block Diagram & Application Guide | Intel MAX 10 FPGA

 

The 10M08SAE144C8G is a non-volatile, single-chip FPGA from Intel’s (formerly Altera) MAX 10 family, fabricated on TSMC’s 55 nm embedded flash process. It integrates 8,000 logic elements, 378 Kbit of M9K embedded SRAM, 24 hardware 18×18-bit multipliers, dual on-die configuration flash images, a 12-bit 1 MSPS SAR ADC with up to 18 analog channels, and 2 PLLs — all within a compact 144-pin EQFP package. Operating from a single 3.3 V supply with instant-on boot (under 10 ms), the 10M08SAE144C8G eliminates external configuration memory, reducing BOM cost and board area for industrial control, communications, and IoT edge applications.

Overview and Part Number Decoding

The 10M08SAE144C8G belongs to the Intel MAX 10 product line — the industry’s first single-chip, non-volatile FPGA family. Unlike SRAM-based FPGAs such as Xilinx Spartan-7 or Intel Cyclone V that require external SPI flash for configuration bitstream storage, MAX 10 devices store up to two complete configuration images in on-die flash memory. This architecture enables instant-on operation within milliseconds of power-up and supports fail-safe remote field updates via the Remote System Upgrade (RSU) IP core — without any external EPCQ or SPI NOR flash on the BOM.

The part number encodes the following attributes:

• 10M08 — MAX 10 family, 8,000 logic elements
• SA — Single-supply, Analog variant (internal 1.2 V regulator, integrated 12-bit ADC)
• E144 — 144-pin Enhanced Quad Flat Package (EQFP) with exposed thermal pad
• C8 — Commercial temperature range (0 °C to +85 °C), speed grade 8
• G — Green / RoHS / Pb-free compliant

The “SA” designation indicates this is the analog-enabled variant that includes a 12-bit, 1 MSPS SAR ADC with up to 18 external analog input channels and an internal temperature sensor — distinguishing it from the “SC” (Compact) variants that lack the integrated ADC. The device is fully supported by Intel Quartus Prime Lite Edition, which is free to download and requires no license file. For current stock and pricing, check 10M08SAE144C8G availability on WWDParts.

Specifications and Parameter Table

Parameter	Value
Manufacturer	Intel (Altera)
Product Family	MAX 10
Part Number	10M08SAE144C8G
Logic Elements (LEs)	8,000
Logic Array Blocks (LABs)	500 (16 LEs per LAB)
M9K Embedded Memory Blocks	42
Total Embedded SRAM	378 Kbit
18×18 Embedded Multipliers	24
Phase-Locked Loops (PLLs)	2 (4 output counters each)
Integrated ADC	Dual 12-bit, 1 MSPS SAR ADC (up to 18 analog channels + internal temperature sensor)
User Flash Memory (UFM)	1,376 Kbit
Configuration Flash Memory	Dual-image internal flash (instant-on, <10 ms boot)
User I/O Pins (E144 package)	101
I/O Banks	8
Maximum LVDS Differential Pairs	15
I/O Standards Supported	3.3 V / 2.5 V / 1.8 V / 1.5 V LVTTL/LVCMOS, LVDS, SSTL, HSTL
Maximum Fabric Frequency	450 MHz (register-to-register, speed grade 8)
M9K Maximum Speed	284 MHz
Core Voltage (VCC)	1.2 V (internally regulated from 3.3 V)
External Supply (VCCA / VCCIO)	3.3 V single rail (2.85–3.465 V)
Process Technology	55 nm (TSMC embedded NOR flash)
Package	144-EQFP (20 × 20 mm body, 0.5 mm pitch, exposed pad)
Operating Temperature	0 °C to +85 °C (Commercial)
Speed Grade	8
RoHS Compliant	Yes (Pb-free)
Lifecycle Status	Active (2026)

Architecture and Block Diagram

The MAX 10 FPGA architecture is organized around a fabric of configurable logic, embedded memory, and DSP resources interconnected by a hierarchical routing network with 20 global clock networks. The 10M08SAE144C8G integrates six core building blocks:

• 8,000 Logic Elements (LEs): Each LE contains a 4-input look-up table (LUT), a programmable register with synchronous load and asynchronous clear, carry chain logic, and register feedback. LEs are grouped into 500 Logic Array Blocks (LABs) of 16 LEs each, with dedicated local interconnect enabling fast intra-LAB routing at minimal skew.
• 42 M9K Memory Blocks (378 Kbit): Each 9,216-bit block (including parity) is configurable as single-port RAM, simple dual-port RAM, true dual-port RAM, ROM, or FIFO buffer. Supports data widths from ×1 to ×36 with byte-enable control, operating at up to 284 MHz.
• 24 Embedded 18×18-bit Multipliers: Dedicated DSP blocks for arithmetic operations. Each block operates as one 18×18-bit multiplier or splits into two independent 9×9-bit multipliers — suitable for FIR filters, PID control loops, motor drive algorithms, and fixed-point arithmetic pipelines.
• 2 PLLs: On-chip phase-locked loops provide clock synthesis, multiplication (up to ×512), division, and dynamic phase shifting. Input frequency range spans 5 MHz to 472.5 MHz with up to 4 independent output clocks per PLL, each with lock detect and dynamic reconfiguration.
• Dual Configuration Flash + 1,376 Kbit UFM: Two on-die configuration images enable fail-safe remote updates via the RSU IP core. The User Flash Memory stores calibration constants, serial numbers, or firmware data non-volatilely, accessible at runtime through the UFM IP core or Avalon-MM interface.
• Dual 12-bit ADC: The “SA” variant includes two 12-bit, 1 MSPS successive approximation register (SAR) ADCs sharing up to 18 external analog input channels. An internal temperature sensor is also accessible. The ADC supports single-ended input ranges of 0–2.5 V (with external reference) and is controlled via a dedicated Modular ADC IP core in Platform Designer.

Figure 1: Intel MAX 10 FPGA family architecture — configurable logic fabric, embedded memory columns, PLLs, DSP blocks, integrated ADC, user flash, and I/O ring. The 10M08SAE144C8G implements this architecture with 8K LEs, 42 M9K blocks, and dual 12-bit ADCs.

Pinout, Package, and PCB Layout

The 10M08SAE144C8G is housed in a 144-pin EQFP (Enhanced Quad Flat Package) with a body size of 20 mm × 20 mm, 0.5 mm lead pitch, and a bottom-side exposed thermal pad. The package provides 101 user I/O pins organized across 8 I/O banks, each with an independent VCCIO supply rail for mixed-voltage interfacing.

Key pinout and layout considerations:

• VCCIO Banks: Each I/O bank supports independent VCCIO. For the “SA” single-supply variant, all VCCIO pins are typically tied to 3.3 V. Mixed-voltage designs can set individual banks to 2.5 V, 1.8 V, or 1.5 V for direct interfacing to external ICs.
• Analog Input Pins (ANAIN1–ANAIN18): The ADC analog input pins are shared with digital I/O on Bank 1A and Bank 1B. When the ADC is enabled, these pins are dedicated analog inputs with a 0–2.5 V input range. Route analog traces away from digital switching signals and provide a low-noise VREFP/VREFN pair from a precision reference.
• JTAG Pins (TCK, TDI, TDO, TMS): Dedicated configuration and boundary-scan pins. Apply 10 kΩ pull-up resistors on TDI and TMS, even when JTAG is unused in production — these pins must not float.
• MSEL[0]: Configuration mode select. Tie to GND for internal configuration mode (standard for MAX 10 instant-on operation).
• Power / Ground: All VCC and GND pins must be connected. Place 100 nF MLCC decoupling capacitors on every power pin, plus a 10 µF bulk capacitor per supply rail near the device.
• Exposed Thermal Pad: The center pad on the package bottom must be soldered to a continuous ground plane for thermal dissipation. Use at least 9 thermal vias (0.3 mm drill) under the pad connecting to inner ground planes.
• LVDS Pairs: Up to 15 true differential LVDS pairs are available. Route with 100 Ω differential impedance, matched-length, on inner PCB layers.

Figure 2: 10M08SAE144C8G in 144-EQFP package — 20 × 20 mm body, 0.5 mm pitch leads, exposed thermal pad on the underside for improved heat dissipation.

Application Circuits and Design Guidelines

The 10M08SAE144C8G targets systems requiring instant-on, non-volatile programmable logic with integrated analog-to-digital conversion and minimal external component count. Typical application domains include:

• Industrial Automation: Motor drive encoder interfaces, PLC I/O expansion modules, sensor aggregation hubs, and protocol bridging (SPI ↔ UART, I2C ↔ parallel bus). The instant-on capability ensures deterministic control outputs within milliseconds of power-up, while the integrated ADC reads temperature, current, and voltage sensors directly without external converter ICs.
• Communications Equipment: Small-cell baseband glue logic, Ethernet MAC-to-PHY bridging, CPRI/OBSAI framing, and multi-protocol serial conversion. The 24 embedded multipliers handle DSP pre-processing in the datapath, and the ADC monitors RF power levels and supply rails.
• Board Management Controllers: Voltage rail power sequencing, system health monitoring (temperature, current), fan speed control, and watchdog supervision. The dual-image flash enables safe firmware updates in the field, and the on-chip ADC samples all critical supply voltages without requiring external ADC ICs.
• IoT and Edge Computing: Smart sensor hubs, LED matrix display controllers, HMI panel interfaces, and compact data loggers. The 1,376 Kbit UFM provides non-volatile storage for calibration data and event logs without external EEPROM. The integrated ADC directly digitizes analog sensor outputs, simplifying the system architecture.

Power Supply Design: The “SA” single-supply variant requires only a single 3.3 V rail (2.85–3.465 V). The internal 1.2 V core regulator draws approximately 60–200 mA depending on logic utilization and clock frequency. The ADC block requires a separate VREFP reference (typically 2.5 V from an external precision reference such as the REF3025 or ADR3425) for accurate analog conversions.

PCB Layout Best Practices:

• Use a 4-layer minimum stackup (signal–ground–power–signal) with dedicated power and ground planes
• Route clock signals on inner layers with 50 Ω controlled impedance; use 100 Ω differential for LVDS pairs
• Keep PLL input clock trace lengths under 50 mm with length-matched output clock routing
• Provide a 10-pin JTAG header (2×5, 2.54 mm pitch) with trace lengths under 150 mm
• Tie MSEL[0] to GND for internal configuration; the device boots in under 10 ms from power-up
• Isolate ADC analog inputs with a guard ring; route analog traces on a separate layer from high-speed digital signals

Figure 3: MAX 10 FPGA development board — a typical application platform showing power supply section, JTAG programming, user I/O headers, and peripheral expansion for prototyping with the 10M08SAE144C8G.

Equivalents, Cross-Reference, and Lifecycle

The 10M08SAE144C8G carries an Active lifecycle status as of 2026 and is broadly stocked by major distributors including Digi-Key, Mouser, Arrow, and LCSC.

Pin-compatible alternatives within the MAX 10 family:

• 10M08SCE144C8G — The “SC” Compact variant in the same 144-EQFP package. Pin-compatible drop-in that omits the ADC; analog input pins become additional digital I/O. Use when ADC is not required to simplify the design.
• 10M04SAE144C8G — Same package and ADC capability, reduced to 4,000 LEs with 189 Kbit embedded RAM (21 M9K blocks). Pin-compatible cost-down option when logic density permits.
• 10M08SAE144I7G — Industrial temperature variant (−40 °C to +100 °C), speed grade 7. Same pinout for harsh-environment deployments.

Cross-vendor alternatives:

• Lattice MachXO3LF-6900 (LCMXO3LF-6900C-5BG256C): Comparable logic density (~6,900 LUTs) with integrated flash. Requires Lattice Diamond; pinout is not compatible.
• Microchip PolarFire MPF100T: Higher-density, low-power flash FPGA for designs outgrowing MAX 10 capacity.

Unit pricing for the 10M08SAE144C8G typically falls in the $10–$20 USD range depending on quantity. To check real-time stock, pricing, or request a quote, upload your BOM to WWDParts for fast processing.

Video: Getting Started with Intel MAX 10 FPGA Development

Video: Getting started with Intel MAX 10 FPGA development using Quartus Prime — workflow applicable to the 10M08SAE144C8G.

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