XC7Z030-1FBG676C is a Zynq-7000 SoC combining two Arm Cortex-A9 cores with Kintex-7-class programmable logic. Use the exact package and speed grade when checking a BOM: figures for a larger Zynq device or a different package can substantially overstate its resources.
The device and package numbers to use
| Parameter | This ordering code | Design implication |
|---|---|---|
| PL architecture and capacity | Kintex-7-class; 125K logic cells | Do not describe Z-7030 as the Artix-7-class fabric used in smaller family members. |
| Logic resources | 78,600 LUTs; 157,200 flip-flops | Check the implemented design against these resources rather than counting marketing logic cells as LUTs. |
| Arithmetic and block RAM | 400 DSP slices; 265 × 36 Kb blocks, listed as 9.3 Mb | Not 900 DSP slices or 17.6 Mb. Block RAM and distributed LUT RAM are different resources. |
| Processor | Dual Cortex-A9; -1C CPU limit 667 MHz at 6:2:1 or 533 MHz at 4:2:1 | Clock configuration matters. Neither 866 MHz nor a family-wide maximum applies to this -1C part. |
| Package | FBG676; 676 balls; 27 × 27 mm; 1.0 mm pitch | UG865 describes a flip-chip lidless BGA. Use its actual mechanical drawing. |
| PL I/O and GTX | 100 HR plus 150 HP I/O; four GTX channels | 250 PL I/O is separate from the PS interface count. GTX is not GTP. |
| PS I/O | 128 in the DS190 package table | Includes dedicated PS interfaces; it does not mean 128 interchangeable MIO pins. |
| Commercial temperature | 0°C to 85°C junction temperature | Include device self-heating when establishing a usable ambient range. |
Manufacturer references: DS190: Zynq-7000 overview, Tables 1 and 3; DS191: Z-7030 electrical specifications and CPU clock Table 19; UG865: package, pinout and FBG676 mechanical drawing.
Decode the full part number
XC7Z030 identifies the device, -1 the speed grade, FBG676 the package and the final C the commercial temperature range. Keep these fields together in engineering and purchasing records. The XC prefix alone does not tell you that every ordering option is commercial-temperature rated.
Do not generate a supposed orderable part simply by replacing one suffix character. DS191 lists selected combinations of speed and temperature grades; confirm the full proposed code against manufacturer ordering information and the written offer. The -1 speed grade is not the fastest grade, and it is not a guarantee of the lowest power or price.
Three I/O categories that must stay separate
HR I/O, HP I/O and GTX channels have different electrical capabilities. DS190 describes HR support up to 3.3 V and HP support up to 1.8 V; the chosen standard must also meet the detailed DS191 limits. Never apply a blanket 3.3 V VCCO assumption to an HP bank. Assign signals by bank, reference requirements and pin function before PCB routing.
FBG676 has a package-level GTX ceiling of 6.6 Gb/s in DS190. A GTX channel is a physical-layer resource, not an automatically complete Ethernet, SATA, camera or PCIe port. Confirm line rate, encoding, IP support, reference clocks and channel requirements. In particular, the presence of GTX does not establish that this package can run a single-lane 10G serial interface.
Manufacturer references: DS190: Zynq-7000 overview, Tables 1 and 3; PG054: Zynq-7000 PCIe device/package support.
Power and startup information belongs in DS191
For this standard -1 device, DS191 gives a 1.0 V nominal PL core supply with a 0.97–1.03 V operating range. That is tighter than a blanket “all rails ±5%” rule. PS, PL, I/O and GTX supplies must each be checked by their own names and limits.
Keep power/reset sequencing separate from boot-image debugging. In the usual memory-boot flow, BootROM loads the first-stage bootloader into on-chip memory; the FSBL then performs the hardware-dependent initialization and loads later components. A blank PL DONE indicator does not necessarily mean the processing system failed to boot.
Manufacturer references: DS191: Z-7030 electrical specifications and CPU clock Table 19; UG1283: BootROM, FSBL and boot-image flow.
Evaluate alternatives as an engineering change
Package dimensions alone do not approve a substitute. Compare the ball functions, bank voltages, reference clocks, GTX connections, power demands and implemented timing. Rebuild or revalidate configuration artifacts for the proposed device as required; do not promise that software and bitstreams need no review.
A larger Zynq-7000 device can be an engineering candidate, but its extra resources do not establish board compatibility. Likewise, an industrial-temperature option does not certify the complete board for industrial or automotive service. Use the replacement checklist below to record approval evidence.
Pricing, lifecycle and availability
No live stock, lifecycle status or unit price is asserted in this guide. A datasheet identifies technical capabilities; it does not show whether a specific lot is available today. Request quantity breaks, currency, lot/packaging details, agreed documents and delivery terms for the exact code.
Historical market prices are not WWDParts quotations. Resolve proposed alternatives with engineering before issuing the purchase order, and state any inspection or traceability requirements in the written agreement.
Related engineering tasks
- Boot, DDR, AXI and serial-link troubleshooting
- Machine-vision acquisition and inspection planning
- Eight-channel data-acquisition bandwidth budget
- Board design-in with HR/HP I/O and GTX links
- Replacement and migration approval checklist
For sourcing, send the complete XC7Z030-1FBG676C ordering code, quantity, required date and documentation needs through Request a quotation. Price, availability, delivery and other commercial terms are confirmed in each written quotation.
Technical review: 8 October 2026, using the linked manufacturer documents. Calculations are stated planning examples; no WWDParts hardware test or certification is claimed.