The XC7A200T-2FBG484I combines the XC7A200T logic and signal-processing resources with the FBG484 package and industrial temperature grade. For a purchasing decision, the complete ordering code matters: a device-family resource table does not tell you how many connections are available in a particular package, and a speed grade is not a system clock specification.
This guide explains the specification fields to carry into a BOM and quotation comparison. For interface allocation and buffer sizing, see the separate XC7A200T I/O, GTP and memory design guide.
Read the complete ordering code
XC7A200T identifies the Artix-7 device; -2 is its speed grade; FBG484 identifies the package; and I identifies the industrial junction-temperature grade. Retain every character when requesting a quotation. AMD's DS180 ordering diagram, Figure 2, explains these fields.
A supplier proposal that changes a package, speed or temperature suffix should be listed as a separate candidate for engineering review. Do not silently shorten the purchase specification to “Artix-7 200T” or accept a different suffix solely because the logic-cell count matches. Keep any approved deviation alongside the BOM revision so that receiving inspection and assembly use the same requirement.
Device resources and package limits
| Specification | XC7A200T in FBG484 |
|---|---|
| Logic cells | 215,360 |
| Logic slices | 33,650 |
| LUTs / flip-flops | 134,600 / 269,200 |
| DSP48E1 slices | 740 |
| Block RAM | 365 × 36 Kb; 13,140 Kb total |
| Clock-management tiles | 10 |
| Package user I/O | 285 HR I/O maximum |
| Package GTP channels | 4 |
| Package body / ball pitch | 23 × 23 mm / 1.0 mm |
Source: DS180 Tables 4–5. LUT and flip-flop totals are calculated from four LUTs and eight flip-flops per slice. Logic cells are a different capacity measure. The device-level maximum of 16 GTP channels requires a larger package; FBG484 exposes four.
These figures are a screening checklist, not evidence that an existing design fits. Ask engineering for the implementation report for the exact target part. A design can have spare arithmetic resources yet fail because of routing congestion, a constrained bank assignment, clock placement or unavailable external connections. Likewise, memory used for coefficients, control software and interface FIFOs is no longer available for application buffers.
Electrical limits to put beside the BOM
For standard -2 operation, DS181 Table 2 specifies VCCINT and VCCBRAM at 0.95–1.05 V, nominally 1.0 V. VCCAUX is 1.71–1.89 V, nominally 1.8 V. The industrial junction operating range is −40 to +100 °C. These are operating conditions, not the absolute maximum ratings.
DS181 Table 52 permits a maximum GTP line rate of 6.6 Gb/s for the standard -2 FB-package column. That figure is neither a fabric clock target nor delivered application payload. The same document distinguishes standard -2 parts from lower-power variants; a speed number alone does not establish power consumption.
During a design review, record where each voltage tolerance is met, which operating temperature was used for timing analysis and which interface settings were selected. For a production purchase, the industrial suffix does not mean the enclosure can operate at +100 °C ambient. Junction temperature also depends on power dissipation and the thermal path. It does not establish qualification for aerospace, medical or safety-critical use.
Use the pinout, not just the package outline
Download the matching device/package entry from AMD's Artix-7 package pinout index. It lists XC7A200T in FBG484 and XC7A100T in FGG484. The codes are not interchangeable names for the same device.
The UG475 packaging and pinout specification is the companion reference for pin definitions and mechanical information. A footprint comparison is only one part of a substitution review. Compare each connected ball, bank voltage, clock input, configuration function and transceiver connection against the schematic and constraints. Record the file revision used; do not treat an unlabeled pin diagram from another package as a release document.
Before authorizing a different density or package, require a fresh implementation and a board-level verification plan. Retaining a nominal package footprint cannot make a bitstream for one device valid for another. If a proposed part requires a board revision, its engineering and requalification cost belongs in the commercial comparison.
Evaluate application claims at the system boundary
Signal processing, image pipelines and programmable interface logic are potential uses, but the component specification does not define a complete system. Ask for a resource and bandwidth budget that identifies the input device, processing stages, memory traffic and output service rate. State whether the requirement is continuous throughput, a peak burst or a maximum response time.
A transceiver is not a universal replacement for every external PHY. Confirm the electrical medium, protocol logic, reference clocks and board channel before removing supporting components from a BOM. A list of protocol names does not show that those interfaces can all coexist on the chosen package.
For a project handover, retain the supported tool release, device selection, IP versions, license requirements, constraints and timing reports. Confirm tool and IP entitlement for the actual project; a family name alone should not be used to promise a free tool flow. Bench acceptance should be defined separately with measurable requirements and test conditions.
Compare quotations without losing the technical requirement
Send the full XC7A200T-2FBG484I code, quantity and required delivery date. Add any approved packaging, date-code, traceability or inspection requirements. Ask the quotation to identify the offered ordering code explicitly and to flag substitutions before acceptance.
- Commercial basis: compare the same quantity, currency, delivery destination and applicable freight or tax assumptions.
- Supply basis: distinguish an offered quantity from a confirmed allocation and record the quotation's validity period.
- Documentation: agree what records are required and available for the offered lot; the blog is not a certificate or a promise of supplied documentation.
- Change control: keep alternative parts separate until engineering and purchasing have approved the exact deviation.
- Lifecycle: request current manufacturer lifecycle and change-notification information relevant to the ordering code. A datasheet publication date does not prove current stock or new-design suitability.
Price, availability, delivery and documentation are confirmed in the written quotation. Find the ordering code in the catalog or prepare an RFQ.
Manufacturer references and dates
- DS180, 7 Series FPGAs Overview — v2.6.1, September 8, 2020; resource tables, package combinations and ordering fields.
- DS181, Artix-7 DC and AC Switching Characteristics — v1.27.1, July 3, 2024; recommended operating conditions and speed/package-specific limits.
- UG475, Packaging and Pinout — v1.20, March 13, 2024; package and pin documentation.
Technical content reviewed October 14, 2026. Document revision dates identify the cited references, not the device launch date or a hardware test date.