STM32F407ZGT6 FPGA: Datasheet, Pinout, Equivalents, and Specs

STM32F407ZGT6 Datasheet, Pinout, Equivalents, and Specs

The STM32F407ZGT6 is a high-performance microcontroller unit (MCU) from STMicroelectronics, belonging to the STM32 F4 series. It is based on the Arm Cortex-M4 32-bit RISC core, which features a Floating Point Unit (FPU) and a full set of DSP instructions. This MCU integrates 1 Mbyte of Flash memory, 192 Kbytes of SRAM, and an extensive range of enhanced I/Os and peripherals, positioning it for advanced embedded applications requiring high computational bandwidth and connectivity.

What is the STM32F407ZGT6?

The STM32F407ZGT6 is an MCU designed for applications demanding a balance of high-performance processing, real-time capabilities, and advanced connectivity. Its internal architecture is built around the 168 MHz Arm Cortex-M4 core, augmented by ST's Adaptive Real-Time (ART) Accelerator, which allows for zero-wait state execution from Flash memory, achieving up to 210 DMIPS. The device is equipped with a comprehensive peripheral set, including an Ethernet MAC 10/100, USB 2.0 OTG full-speed and high-speed, multiple SPI, I2C, and USART interfaces, and advanced motor control timers. These features make it suitable for target markets such as industrial automation, motor control systems, medical equipment, and IoT gateways where complex algorithms and network connectivity are required.

Pinout Configuration and Packaging

The STM32F407ZGT6 is supplied in a 144-pin Low-Quad Flat Package (LQFP-144). This package provides a high I/O-to-footprint ratio, suitable for complex designs. The pinout distributes multiple power supply (VDD, VSS) and analog reference (VDDA, VSSA) pins around the package to ensure signal integrity and stable operation. Critical I/O pins include those for the High-Speed External (HSE) oscillator, JTAG/SWD debugging interface, and dedicated pins for high-speed peripherals like Ethernet (RMII/MII) and USB. Thermal management is achieved via the exposed pad (if present on the specific package variant) and proper PCB layout with thermal vias to a ground plane, with a thermal resistance (Junction-to-ambient) that must be considered in high-duty-cycle applications.

Core Architectural Features

  • High-Performance Core: Features the Arm Cortex-M4 core operating at up to 168 MHz. The integrated single-precision FPU and DSP instruction set accelerate mathematical computations, crucial for filtering, motor control, and signal processing algorithms without loading the main CPU.
  • Memory Subsystem: Incorporates 1 Mbyte of on-chip Flash memory for program storage and 192 Kbytes of SRAM. The memory architecture is optimized with ST's ART Accelerator, which uses an instruction prefetch queue and branch cache to enable zero-wait state performance from Flash at full clock speed.
  • Extensive Connectivity Peripherals: Provides a rich set of communication interfaces, including an IEEE 802.3-compliant Ethernet MAC with DMA support, a USB 2.0 OTG controller with both Full-Speed and High-Speed PHY capabilities, two CAN 2.0B active interfaces, three I2C, six SPI (three with I2S), and multiple UART/USART ports.
  • Advanced Analog and Timer Functions: Equipped with three 12-bit Analog-to-Digital Converters (ADCs) capable of 2.4 MSPS, two 12-bit Digital-to-Analog Converters (DACs), and up to seventeen timers. This includes two advanced-control timers for six-step or FOC motor control, ten general-purpose 16/32-bit timers, and two basic timers.

Specifications Parameter Table

Specification Technical Details
Core Processor Arm Cortex-M4 with FPU
Maximum CPU Frequency 168 MHz
Flash Memory Size 1 Mbyte
SRAM Size 192 Kbytes
Operating Supply Voltage (Vdd) 1.8V to 3.6V
Package / Case LQFP-144 (20x20mm)

STM32F407ZGT6 Equivalents, Cross Reference, and Lifecycle

The STM32F407ZGT6 is in "Active" production status, supported by STMicroelectronics' 10-year longevity commitment program, ensuring long-term availability for industrial designs. When sourcing alternatives due to allocation or long lead times, engineers should first consider other parts within the STM32F4 family. A potential near-equivalent is the STM32F417ZGT6; it is pin-to-pin compatible in the same LQFP-144 package and offers the same core, memory, and peripheral set, with the addition of a cryptographic hardware accelerator. If the crypto module is not used, the STM32F417ZGT6 can often serve as a drop-in replacement after firmware verification. Another option is the STM32F427ZGT6, which is also pin-compatible but offers a higher core frequency (180 MHz) and more SRAM (256 KB), making it a viable upgrade path. It is critical to verify the datasheet for any subtle electrical or timing differences before substitution. Alternatives from other manufacturers, such as the NXP LPC series, are not pin-compatible and would require a complete hardware and software redesign.

Typical Application & Circuit Considerations

In system-level design, the STM32F407ZGT6 requires careful power supply decoupling. A 100nF ceramic capacitor should be placed as close as possible to each VDD/VSS pair, supplemented by a larger bulk capacitor (e.g., 4.7µF to 10µF) for the entire board. The analog supply pin (VDDA) must be filtered separately, often with an LC filter (ferrite bead and capacitor), to ensure ADC/DAC performance. For applications using the high-speed peripherals like Ethernet or USB HS, a stable High-Speed External (HSE) crystal oscillator (typically 8 MHz or 25 MHz) is mandatory. PCB layout for the HSE crystal must follow best practices, with short, symmetrical traces to the XTAL pins and a local ground guard ring to minimize noise coupling. The internal voltage regulator requires external capacitors on the VCAP1 and VCAP2 pins, which are essential for core stability.

Video Demonstration

Market Availability and Pricing Trends

High-performance MCUs like the STM32F407ZGT6 are subject to dynamic supply chain conditions, which can result in extended lead times and allocation from manufacturers. Component buyers and engineers should plan for procurement cycles that can vary based on global semiconductor demand. To check real-time stock, pricing, or to request a quote for the STM32F407ZGT6 and its verified alternatives, upload your BOM to WWDParts for fast processing.


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Alan Carter

Senior Hardware Engineer & Component Specialist

Alan has over 15 years of expertise in embedded systems design, FPGA architecture, and global semiconductor supply chains. He specializes in component cross-referencing, lifecycle management, and helping OEMs navigate supply shortages.

Frequently Asked Questions (FAQs)

What is the current lifecycle status of the STM32F407ZGT6?

As of late 2023, the STM32F407ZGT6 is in "Active" production status by STMicroelectronics. It is not considered NRND (Not Recommended for New Designs) or obsolete. ST guarantees a minimum 10-year longevity commitment for this device, starting from its introduction date. Always verify the latest status with an authorized distributor for long-term production planning.

What are the typical lead times for the STM32F407ZGT6, and how have they been affected by market conditions?

Historically, lead times were in the 12-16 week range. However, due to global semiconductor shortages, lead times have fluctuated significantly, sometimes extending to over 52 weeks. It is crucial to check real-time inventory with distributors and consider placing orders well in advance of production needs to mitigate supply chain risks.

Are there any drop-in or pin-compatible replacements for the STM32F407ZGT6 if it's unavailable?

The STM32F417ZGT6 is a direct pin-compatible alternative in the same LQFP144 package, offering the same features plus a cryptographic hardware accelerator. The STM32F207ZGT6 is also pin-compatible but belongs to an older series with lower performance (120 MHz vs 168 MHz). For any replacement, firmware must be re-verified for clock configuration and peripheral compatibility.

Does the FPU in the STM32F407ZGT6 support double-precision floating-point operations?

No, the ARM Cortex-M4F core's Floating-Point Unit (FPU) in the STM32F407ZGT6 is a single-precision unit (FPv4-SP). It provides hardware acceleration for 32-bit `float` operations but not for 64-bit `double` operations. Double-precision calculations must be emulated in software, which results in a significant performance penalty compared to native hardware execution.

What is the maximum sampling rate of the ADCs, and how is it achieved?

The STM32F407ZGT6 features three independent 12-bit ADCs. Each ADC can achieve a maximum sampling rate of 2.4 MSPS (Mega Samples Per Second). When the three ADCs are used in interleaved mode, a combined sampling rate of up to 7.2 MSPS can be achieved. This high-speed mode requires precise clock configuration (ADCCLK) and leveraging the DMA controller to transfer conversion data without CPU intervention.

What are the typical current consumption figures in Run mode versus STOP mode?

In Run mode at 168 MHz with all peripherals enabled and executing from Flash memory, the typical current consumption is around 40 mA (approximately 238 µA/MHz). In STOP mode, where the core is stopped but SRAM and register contents are retained with low-power regulators active, the current consumption drops significantly to approximately 22 µA, making it suitable for battery-powered applications with intermittent activity.

What are the specific capabilities of the Digital Camera Interface (DCMI) on this MCU?

The DCMI supports an 8, 10, 12, or 14-bit parallel interface for connecting CMOS camera sensors. It can handle various data formats like YCbCr 4:2:2, RGB 565, and raw Bayer. The interface supports continuous or snapshot modes and can transfer data directly to memory via its dedicated DMA channel, minimizing CPU overhead for video streaming or image capture applications.

What is the pin pitch of the LQFP144 package, and what are the PCB design implications?

The STM32F407ZGT6 in the LQFP144 package has a 0.5 mm pin pitch. This fine pitch requires precise PCB manufacturing and assembly processes. It typically necessitates a multi-layer PCB (4 layers is common) to effectively route all signals, especially for high-speed peripherals like SDIO or Ethernet (RMII/MII). Careful attention must be paid to trace impedance, length matching, and placing decoupling capacitors as close as possible to the VDD/VSS pins.

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