10AT115N2F40E2SGES Datasheet, Pinout, Block Diagram & Application Guide | Intel Arria 10 GT FPGA

The 10AT115N2F40E2SGES is a high-performance FPGA from Intel’s (formerly Altera) Arria 10 GT family, fabricated on TSMC’s 20 nm process. It integrates 1,150,000 logic elements, 427,200 adaptive logic modules (ALMs), 65.7 Mb of M20K embedded SRAM, 1,518 variable-precision DSP blocks with IEEE 754 floating-point support, 72 full-duplex NRZ transceivers capable of 25.78 Gbps chip-to-chip data rates, and 48 fractional PLLs — all within a 1517-pin FCBGA package (40 × 40 mm). The “GT” designation indicates the transceiver-optimized variant of the Arria 10 family, engineered for 100G Ethernet, OTN, optical interconnects, and high-bandwidth data-center acceleration where line-rate serial I/O is critical.

Overview and Part Number Decoding

The 10AT115N2F40E2SGES belongs to the Intel Arria 10 GT product line — the transceiver-rich tier of the Arria 10 family built on a 20 nm process node. Unlike entry-level FPGA families such as Intel MAX 10 or Cyclone V, Arria 10 GT devices target bandwidth-intensive workloads requiring serial I/O rates up to 25.78 Gbps per lane. The GT variant differentiates itself from the GX series by offering higher transceiver speed grades optimized for 100G Ethernet, Interlaken, OTN OTU4, and coherent optical module control planes.

The part number encodes the following attributes:

• 10A — Arria 10 FPGA family
• T — GT variant (transceiver-optimized, up to 25.78 Gbps)
• 115 — 1,150K logic elements (largest density in the Arria 10 lineup)
• N2 — Transceiver configuration variant (N-type, configuration 2)
• F40 — 1517-pin FineLine BGA package, 40 × 40 mm body
• E2 — Extended temperature grade, speed grade –E2
• SG — Standard ordering code
• ES — Engineering Sample

The “N2” configuration specifies one of several transceiver channel allocations available on the 1150K die, while the “E2” speed grade sits in the middle of the extended-temperature range (–E1 fastest, –E3 slowest). Engineering-sample parts carry the “ES” suffix and are intended for prototyping and validation prior to production qualification. The device is fully supported by Intel Quartus Prime Pro Edition. For current stock and pricing, check 10AT115N2F40E2SGES availability on WWDParts.

Specifications and Parameter Table

Parameter	Value
Manufacturer	Intel (Altera)
Product Family	Arria 10 GT
Part Number	10AT115N2F40E2SGES
Logic Elements (LEs)	1,150,000
Adaptive Logic Modules (ALMs)	427,200
ALM Registers	1,708,800
M20K Embedded Memory	65.7 Mb (2,713 M20K blocks)
MLAB Memory	11.7 Mb
Variable-Precision DSP Blocks	1,518
DSP Modes	18×19, 27×27, single-precision IEEE 754 floating-point
NRZ Transceivers	72 full-duplex
Maximum Transceiver Data Rate	25.78 Gbps (chip-to-chip), 12.5 Gbps (backplane)
Maximum LVDS Pairs	312
Maximum User I/O Pins	624
Fabric & I/O PLLs	48
Hard IP Blocks	PCIe Gen3 ×8 (up to 4 instances), Hard Memory Controller
External Memory Interfaces	DDR4, DDR3, DDR3L, LPDDR3, QDR II, QDR II+, QDR IV, RLDRAM 3
Core Voltage (VCC)	0.87 V – 0.93 V (nominal 0.9 V)
Process Technology	20 nm (TSMC)
Package	1517-Pin FCBGA (40 × 40 mm, 1.0 mm pitch)
Operating Temperature	Extended: 0 °C to +100 °C (TJ)
Speed Grade	–E2 (Extended)
Device Status	Engineering Sample (ES)
RoHS Compliant	Yes (Pb-free)
Launch Year	2013

Architecture and Block Diagram

The Arria 10 GT architecture is organized around a 20 nm fabric optimized for high logic density and transceiver throughput, delivering up to 2× the core performance-per-watt compared to the previous-generation Stratix V. The 10AT115N2F40E2SGES integrates these core building blocks:

• 427,200 Adaptive Logic Modules (ALMs): Each ALM contains an 8-input fracturable look-up table (decomposable into two independent 4-input LUTs), four dedicated registers with independent clock and clear, two full adders, and a shared arithmetic carry chain. ALMs are grouped into Logic Array Blocks (LABs) of 10 ALMs each, connected by a column-based interconnect fabric with 20 global clock networks and local/regional routing.
• 65.7 Mb M20K Embedded Memory (2,713 blocks): Each 20 Kbit block supports single-port, simple dual-port, true dual-port, ROM, and FIFO configurations with byte-enable and ECC. Data widths span ×1 to ×40 with operating frequencies exceeding 500 MHz. An additional 11.7 Mb of MLAB (Memory LAB) distributed RAM provides shallow, wide storage for register files and FIFOs.
• 1,518 Variable-Precision DSP Blocks: Each block can be configured as one 27×27 multiplier, two 18×19 multipliers, or a single-precision IEEE 754 floating-point multiply-add unit. This native floating-point capability — unique to Arria 10 among mid-range FPGAs — eliminates the DSP resource overhead of soft-IP floating-point, delivering up to 1.5 TFLOPS aggregate throughput for radar, image processing, and scientific computing workloads.
• 72 NRZ Transceivers (up to 25.78 Gbps): The GT variant’s defining feature. Each transceiver channel includes a CDR, TX/RX equalization (DFE, CTLE), pattern generator/checker, and protocol-specific PCS blocks. Supported protocols include 100GBASE-R, Interlaken, OTN OTU4, CPRI, JESD204B, PCIe Gen3, and custom serial links. Backplane channels are rated at 12.5 Gbps.
• 48 Fractional PLLs: On-chip fractional-N PLLs provide sub-ppm frequency resolution for jitter-sensitive transceiver reference clocks, video pixel clocks, and system timing. Each PLL supports up to 9 output taps with dynamic reconfiguration.
• Hard IP Blocks: Up to 4 instances of PCIe Gen3 ×8 hard IP with integrated DMA, plus hard DDR4/DDR3 memory controllers with built-in ECC and PHY — freeing logic resources for application-level functions.

Figure 1: Intel Arria 10 FPGA family architecture — ALM-based logic fabric, M20K memory columns, variable-precision DSP arrays, high-speed transceiver banks, PCIe Gen3 hard IP, hard memory controllers, and I/O ring. The 10AT115N2F40E2SGES implements this architecture with 427K ALMs, 72 transceivers at 25.78 Gbps, and 1,518 DSP blocks.

Pinout, Package, and PCB Layout

The 10AT115N2F40E2SGES is housed in a 1517-pin FCBGA (Flip Chip Ball Grid Array) with a body size of 40 × 40 mm and 1.0 mm ball pitch. The package provides up to 624 user I/O pins organized across multiple I/O banks, each with independent VCCIO supply rail for mixed-voltage interfacing, plus dedicated transceiver banks containing the 72 full-duplex serial channels.

Key pinout and layout considerations:

• Transceiver Banks: The 72 transceivers are organized into banks of 6 channels each. Each bank has its own reference clock input (REFCLK) requiring a low-jitter oscillator or clock generator. Route differential transceiver pairs with 85 Ω or 100 Ω controlled impedance depending on the target protocol, using stripline on inner layers with continuous reference planes.
• VCCIO Banks: General-purpose I/O banks support 3.3 V, 2.5 V, 1.8 V, 1.5 V, and 1.2 V LVCMOS/LVTTL, as well as LVDS, SSTL, HSTL, and HSUL standards. Each bank has an independent VCCIO rail for multi-voltage interfacing.
• Power Distribution: The core operates at 0.9 V nominal (VCC), requiring a high-current (>20 A typical) regulator with tight load regulation. Separate supply rails include VCCA_PLL (analog PLL supply, 2.5 V), VCCR/VCCT (transceiver supply, 1.0 V / 1.8 V), and VCCIO per bank. Place 100 nF MLCC decoupling on every power ball, with bulk 47–100 µF capacitors near the device.
• JTAG Configuration (TCK, TDI, TDO, TMS): Dedicated JTAG pins for configuration and debug via Intel Quartus Prime Programmer. Use 10 kΩ pull-up on TDI and TMS. The AS (Active Serial) configuration mode using an EPCQ/EPCQA flash is typical for production boards.
• Thermal Management: The 1517-FCBGA package dissipates significant power under full transceiver load. Use a multi-layer PCB (12+ layers recommended) with dedicated power and ground planes, thermal vias under the die area, and an appropriately sized heatsink with TIM (thermal interface material). Monitor T_J via the on-die thermal diode accessible through Intel’s System Monitor IP.
• High-Speed Memory Interface: Hard DDR4 controller pins are located on dedicated I/O banks with impedance-matched routing. Use 40 Ω single-ended / 80 Ω differential impedance for DDR4 data and strobe signals. Length-match DQ to DQS within 10 mil per byte lane.

Figure 2: 10AT115N2F40E2SGES in 1517-Pin FCBGA package — 40 × 40 mm body, 1.0 mm ball pitch, flip-chip construction for optimized thermal and electrical performance.

Application Circuits and Design Guidelines

The 10AT115N2F40E2SGES targets systems requiring massive serial bandwidth, high logic density, and hardware floating-point DSP in a single device. Typical application domains include:

• 100G Ethernet & Optical Networking: The 72 transceivers at 25.78 Gbps directly implement 100GBASE-R (4×25 Gbps) line cards, OTN OTU4 framers, and CFP2/CFP4 optical module controllers. The hard PCS and soft MAC IP enable multi-port 100G aggregation switches and muxponders without external SerDes devices.
• Data Center Acceleration: With 1,518 floating-point DSP blocks and PCIe Gen3 ×8 hard IP, the device serves as an FPGA accelerator card for machine learning inference, database query offload, compression/encryption engines, and network function virtualization (NFV). The hard memory controller drives DDR4 DIMMs for local buffer storage.
• Test & Measurement: High-speed protocol analyzers, bit-error-rate testers (BERT), and waveform generators leverage the 25.78 Gbps transceivers and deep M20K capture buffers. The variable-precision DSP blocks perform real-time FFT, digital down-conversion, and spectral analysis on captured data streams.
• Radar & Defense: Phased-array radar digital beamforming, electronic warfare (EW) signal processing, and SIGINT applications exploit the floating-point DSP for complex-valued matrix arithmetic while the high-speed transceivers interface to ADC/DAC front-ends via JESD204B at up to 12.5 Gbps per lane.

Power Supply Design: A typical power tree for the 10AT115N2F40E2SGES includes: VCC core (0.9 V, 20–40 A), VCCA_PLL (2.5 V, <1 A), VCCT/VCCR transceiver (1.0 V + 1.8 V, 5–15 A), VCCIO per bank (1.2–3.3 V, 1–3 A each), and VCCPD (3.0 V pre-driver). Use Intel’s Early Power Estimator (EPE) spreadsheet with your target design utilization to size regulators accurately. Multi-phase voltage regulators (e.g., Intel Enpirion EM2130 or Analog Devices LTM4677) are recommended for the VCC core rail.

PCB Layout Best Practices:

• Use a 12–20 layer stackup with dedicated power planes for VCC, VCCT, VCCR, and VCCIO banks
• Route transceiver differential pairs as edge-coupled stripline with 85 Ω or 100 Ω impedance; minimize via stubs using back-drilling or HDI microvias
• Provide separate analog ground pour under PLL supply pins, connected to digital ground at a single point near the device
• Place REFCLK oscillators within 25 mm of transceiver reference clock input pins; use <1 ps RMS jitter clock sources for 25G links
• Implement full power sequencing per Intel’s recommended sequence: VCCR/VCCT → VCC → VCCIO → VCCA_PLL

Figure 3: Intel Arria 10 FPGA circuit design reference — showing key pin groups, power supply connections, and peripheral interface routing applicable to the 10AT115N2F40E2SGES in high-speed networking and data center applications.

Equivalents, Cross-Reference, and Lifecycle

The 10AT115N2F40E2SGES is an engineering sample with Launched family lifecycle status as of 2026. Production equivalents are available through Intel’s authorized distribution channels.

Alternatives within the Arria 10 family:

• 10AX115N2F40E2SG (Arria 10 GX) — Same 1150K LE density and F40 package, but with GX-class transceivers rated at 17.4 Gbps instead of 25.78 Gbps. Lower cost option when 25G serial lanes are not required.
• 10AT115S1F45E1SG — Same GT family and density in the larger F45 (1932-pin) package with more user I/O. Higher pin count for designs needing additional parallel I/O or transceiver channels.
• 10AT115S2F45E2SG — GT 1150K in F45 package, S2 transceiver configuration, –E2 speed grade. Production-qualified (non-ES) variant.

Cross-vendor alternatives:

• Xilinx Virtex UltraScale VU095 (XCVU095-2FFVA2104E): Comparable logic density with GTY transceivers at 30.5 Gbps. UltraRAM for deeper on-chip buffering. Requires Vivado Design Suite.
• Xilinx Kintex UltraScale KU115 (XCKU115-2FLVA1517E): Similar 1517-pin FCBGA footprint with GTH transceivers at 16.3 Gbps. Lower cost per logic element but slower transceiver rate.

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Video: Intel Arria 10 FPGA Development Overview

Video: Intel Arria 10 FPGA development overview — architecture walkthrough and design workflow applicable to the 10AT115N2F40E2SGES GT variant.

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