EP4CE22F17C6N Datasheet, Pinout, Equivalents, and Specs

The EP4CE22F17C6N is a high-performance FPGA from Intel's (formerly Altera) Cyclone IV E family, fabricated on a 60 nm low-power process with a 1.2 V core supply. It integrates 22,320 logic elements, 594 Kbit of embedded M9K SRAM, 66 embedded 18×18 multipliers, and 4 PLLs in a compact 256-pin FineLine BGA package. With 153 user I/O pins, speed grade C6 (the fastest commercial option reaching 472.5 MHz), and commercial-grade operation (0 °C to 85 °C), the EP4CE22F17C6N is the FPGA at the heart of the popular Terasic DE0-Nano development board — making it one of the most widely used Cyclone IV devices for prototyping, education, and production embedded systems.

What Is the EP4CE22F17C6N?

The EP4CE22F17C6N belongs to the Cyclone IV E family — the fourth generation of Altera's low-cost FPGA line launched in 2009. The part number decodes as follows: "EP4CE22" indicates the 22,320-LE density variant of the Cyclone IV E series, "F17" identifies the 256-pin FineLine BGA package with a 17 × 17 mm body, "C6" denotes commercial-grade silicon at speed grade 6 (the fastest commercial tier), and the trailing "N" signifies RoHS-compliant lead-free ball terminations.

Internally, the device organizes its 22,320 logic elements into 1,395 Logic Array Blocks (LABs), each containing 16 adaptive LEs. Every LE includes a four-input look-up table (LUT), a programmable register, carry chain logic, and register chain connections — enabling efficient implementation of both combinational and sequential functions. The MultiTrack interconnect architecture uses DirectDrive technology with continuous routing lines of varying lengths to achieve fast, predictable signal propagation across the die.

The 66 M9K embedded memory blocks provide 594 Kbit of dual-port SRAM, each configurable as single-port RAM, simple dual-port, true dual-port RAM, ROM, or FIFO buffers operating at up to 290 MHz (C6 speed grade). The 66 embedded 18×18 multipliers support high-throughput DSP operations, with each block capable of implementing one 18×18 or two independent 9×9 multiplications. Four general-purpose PLLs deliver clock synthesis, multiplication, division, and phase shifting across 20 global clock networks.

Pinout Configuration and Packaging

The EP4CE22F17C6N is housed in a 256-pin FineLine BGA (FBGA) package with a 17 × 17 mm body and 1.0 mm ball pitch. The BGA uses a 16 × 16 ball grid array with depopulated corners. Of the 256 balls, 153 are available as user I/O, distributed across four independent I/O banks.

Each I/O bank supports an independent VCCIO supply rail, enabling mixed-voltage interfacing within a single device. The I/O element (IOE) architecture supports multiple single-ended standards — LVTTL (3.3 V), LVCMOS (1.2 V to 3.3 V), SSTL-2, SSTL-18, and HSTL — along with differential LVDS at up to 640 Mbps, mini-LVDS, RSDS, LVPECL, BLVDS, and PPDS. PCI and PCI-X compliance is supported for 33 MHz and 66 MHz bus operation.

The F17 package provides dedicated clock input pins that connect directly to the 20 global clock networks and 4 PLLs. Configuration pins support Active Serial (AS) mode using an EPCS16 or EPCS64 serial configuration device, Passive Serial (PS), Fast Passive Parallel (FPP), and JTAG via the IEEE 1149.1 boundary-scan port. The MSEL[1:0] pins determine the configuration scheme at power-up. BGA ball assignments are documented in the Cyclone IV E Pin-Out Files available from Intel's download center.

Specifications Parameter Table

Specification	Technical Details
Device Family	Cyclone IV E (Intel / Altera)
Process Node	60 nm low-power CMOS
Logic Elements (LEs)	22,320
Logic Array Blocks (LABs)	1,395
M9K Memory Blocks	66
Total Embedded RAM	594 Kbit
Embedded 18×18 Multipliers	66
PLLs	4 (5 outputs per PLL)
Global Clock Networks	20
User I/O Pins	153
I/O Banks	4
Package	256-FBGA (17 × 17 mm, 1.0 mm ball pitch)
Core Voltage (VCCINT)	1.15 V to 1.25 V (nominal 1.2 V)
Max I/O Voltage (VCCIO)	3.6 V
Clock Network Performance (C6)	472.5 MHz
Speed Grade	C6 (Commercial, 0 °C to 85 °C)
I/O Standards	LVTTL, LVCMOS, SSTL-2, SSTL-18, HSTL, LVDS, PCI, PCI-X
External Memory Interfaces	DDR, DDR2, SDR SDRAM
Configuration Modes	Active Serial (AS), Passive Serial (PS), FPP, JTAG
RoHS Compliant	Yes (lead-free, "N" suffix)

Typical Applications and Circuit Considerations

The EP4CE22F17C6N is designed for applications requiring high programmable logic density in a compact BGA footprint. Its combination of 22,320 LEs, 66 multipliers, 594 Kbit embedded RAM, and the fastest commercial speed grade makes it suitable for demanding embedded system designs:

• Education and Prototyping (DE0-Nano): The EP4CE22F17C6N is the FPGA on the Terasic DE0-Nano development board — one of the most popular FPGA educational platforms worldwide. The DE0-Nano pairs this FPGA with 32 MB SDRAM, a 3-axis accelerometer, ADC, LEDs, switches, and two 40-pin GPIO headers, enabling rapid prototyping of digital logic, embedded processors (Nios II), robotics controllers, and signal processing designs.
• Industrial Control and Motor Drive: The FPGA's deterministic timing and parallel processing capability enable multi-axis servo controllers, PLC coprocessors, and custom fieldbus protocol engines. The 66 embedded multipliers accelerate PID loop calculations, sensor fusion, and real-time signal conditioning without consuming logic resources.
• Embedded DSP and Baseband Processing: The 66 multiplier blocks — matching the resource level of the larger EP4CE30 — support FIR/IIR filtering, FFT computation, digital down-conversion, and modulation/demodulation. Quartus Prime includes optimized DSP IP cores (FIR Compiler, FFT, NCO) that efficiently map to the Cyclone IV E multiplier architecture.
• Video and Image Processing: With 153 I/O pins and substantial logic and memory resources, the EP4CE22F17C6N supports VGA/HDMI display controllers, camera sensor interfaces (DVP parallel), real-time image filtering, and framebuffer management using external SDRAM.
• Communications Protocol Bridging: Four independent I/O banks with separate VCCIO supplies enable flexible multi-voltage protocol translation — bridging between processors, ADCs, DACs, and communication interfaces such as Ethernet PHYs, SPI, I2C, UART, and custom serial engines.

For power supply design, Altera recommends separate decoupling for V_CCINT (1.2 V core), V_CCIO (per-bank), and V_CCA (PLL analog supply at 2.5 V). Each power ball on the BGA should have a 0.1 µF ceramic capacitor placed within 2 mm of the via, supplemented by bulk capacitors of 10–47 µF per rail. The 256-FBGA requires a minimum of 4 PCB routing layers for full pin escape. Browse Cyclone IV Series components for related power management and configuration ICs.

Video Tutorial

Equivalents, Cross-Reference, and Lifecycle

The EP4CE22F17C6N remains in active production status as of 2026, with Intel extending the Cyclone IV family lifecycle through 2040 — ensuring long-term availability for industrial and automotive designs. For designs requiring alternative density or migration paths, consider these options:

• EP4CE22F17C8N: Same 256-FBGA package and die, but with the slower C8 speed grade (402 MHz global clock) at a lower price point. Drop-in replacement when the faster C6 timing is not required.
• EP4CE15F17C8N: Reduced density variant (15,408 LEs) in the same 256-FBGA package. Pin-compatible for cost-down when logic utilization permits fewer resources.
• EP4CE22F23C8N: Same 22,320 LE die in a larger 484-FBGA (23 mm) package, providing 325 user I/Os and 8 I/O banks for designs requiring wider buses or more external connections.
• EP4CE30F23C8N: Maximum density in the Cyclone IV E family with 28,848 LEs, 66 multipliers, and 594 Kbit RAM. Available only in the F23 and F29 packages for compute-intensive applications.
• 10M16SAU169C8G (MAX 10): Intel's newer non-volatile FPGA family in 55 nm. The MAX 10 offers integrated flash configuration (no external EPCS required) and an internal oscillator, though the pinout and package differ from Cyclone IV.

When sourcing the EP4CE22F17C6N, verify the full ordering code — the "C6" suffix indicates commercial temperature range and speed grade 6 (fastest); the slower "C7" and "C8" grades are separate SKUs with different timing characteristics. Industrial variants use "I7" (EP4CE22F17I7N) with extended -40 °C to 100 °C operation. Check EP4CE22F17C6N Inventory & Pricing for current stock and lead times. Also see our catalog of Intel FPGA and programmable logic devices for cross-compatible alternatives.

Frequently Asked Questions (EP4CE22F17C6N FAQ)

Q: What is the difference between EP4CE22F17C6N and EP4CE22F23C8N?

A: Both share the same EP4CE22 silicon die with 22,320 logic elements, but differ in package and speed grade. The EP4CE22F17C6N uses a 256-FBGA (17 mm) with 153 user I/Os and 4 I/O banks, while the EP4CE22F23C8N uses a larger 484-FBGA (23 mm) with 325 user I/Os and 8 I/O banks. The F17 variant carries speed grade C6 (fastest commercial, ~472.5 MHz global clock) versus C8 (slowest, ~402 MHz) on the F23. Choose the F17 for compact designs needing high performance; choose the F23 when more I/O pins or wider DDR2 buses are required.

Q: What development tools are required to program the EP4CE22F17C6N?

A: The EP4CE22F17C6N is programmed using Intel Quartus Prime Lite Edition, which is a free download with full Cyclone IV support and no license restrictions. Design entry supports Verilog HDL, VHDL, and schematic capture. A USB Blaster or USB Blaster II JTAG programmer is required for configuration. The Terasic DE0-Nano development board includes an on-board USB Blaster, 32 MB SDRAM, an 8-channel ADC, a 3-axis accelerometer, and ready-to-use example projects — making it the fastest way to start working with this FPGA.

Q: What is the maximum operating frequency of the EP4CE22F17C6N?

A: The EP4CE22F17C6N carries speed grade C6, the fastest of three commercial grades. Its global clock network performance reaches approximately 472.5 MHz, with simple register-to-register paths capable of up to 500 MHz. The slower C7 and C8 grades achieve 437.5 MHz and 402 MHz respectively. Actual achievable frequency depends on design complexity, routing congestion, and timing constraints applied during Quartus compilation. TimeQuest Timing Analyzer should be used during design closure to verify timing margins.

Q: What package type is the EP4CE22F17C6N and what are its PCB layout considerations?

A: The EP4CE22F17C6N uses a 256-pin FineLine BGA (FBGA) package with a 17 × 17 mm body and 1.0 mm ball pitch. PCB layout requires a minimum of 4 routing layers for full pin escape — fewer than the larger 484-FBGA variants. Each power ball requires a 0.1 µF ceramic capacitor placed within 2 mm of the via, supplemented by 10–47 µF bulk capacitors per power rail. BGA soldering requires a reflow oven with a controlled thermal profile per JEDEC J-STD-020 guidelines. Altera provides Allegro and Altium land pattern files for download.

Q: Can the EP4CE22F17C6N interface with DDR2 SDRAM?

A: Yes. The Cyclone IV E family fully supports DDR, DDR2, and SDR SDRAM external memory interfaces. The 256-FBGA package supports up to a 16-bit DDR2 data bus using the available DQS-capable pins. Quartus Prime includes the ALTMEMPHY megafunction to generate optimized memory controllers with DLL-based clock phase calibration. The Terasic DE0-Nano demonstrates a working 32 MB (16-bit) SDRAM interface at full speed with this FPGA.

Q: What are the power consumption characteristics of the EP4CE22F17C6N?

A: Static power consumption at 85 °C junction temperature is typically 60–80 mW. Dynamic power depends on design-specific factors including clock frequency, toggle rate, logic utilization, and I/O switching activity. Intel provides the PowerPlay Early Power Estimator (EPE) spreadsheet for pre-design budgeting and the Quartus Prime Power Analyzer for post-compilation accuracy. The 1.2 V core supply and 60 nm process keep total power below 1 W for most typical designs. The 256-FBGA package provides adequate thermal dissipation through the ball array to the PCB ground plane, typically eliminating the need for a heatsink.

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