10AS016C4U19I3LG vs 10AS016C4U19E3LG vs 10AS016C4U19E3SG

Same silicon die in different packages — compare I/O count, footprint, and form factor to find the best fit for your PCB design.

Parameter 10AS016C4U19I3LG Current 10AS016C4U19E3LG 10AS016C4U19E3SG
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Speed 1.5GHz 1.5GHz 1.5GHz
Architecture MCU, FPGA MCU, FPGA MCU, FPGA
RAM Size 256KB 256KB 256KB
Package / Case 484-BFBGA 484-BFBGA 484-BFBGA
Operating Temperature -40°C ~ 100°C (TJ) 0°C ~ 100°C (TJ) 0°C ~ 100°C (TJ)
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals DMA, POR, WDT DMA, POR, WDT DMA, POR, WDT
Product Status Active Active Active
RoHS Compliant Compliant Compliant
Price $884.26 $737.61 $589.51
Availability In Stock In Stock In Stock

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