10AS016E3F27E1SG vs 10AS016E3F27E1HG vs 10AS016E3F27E2LG

Same silicon die in different packages — compare I/O count, footprint, and form factor to find the best fit for your PCB design.

Parameter 10AS016E3F27E1SG Current 10AS016E3F27E1HG 10AS016E3F27E2LG
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Speed 1.5GHz 1.5GHz 1.5GHz
Architecture MCU, FPGA MCU, FPGA MCU, FPGA
RAM Size 256KB 256KB 256KB
Package / Case 672-BBGA, FCBGA 672-BBGA, FCBGA 672-BBGA, FCBGA
Operating Temperature 0°C ~ 100°C (TJ) 0°C ~ 100°C (TJ) 0°C ~ 100°C (TJ)
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals DMA, POR, WDT DMA, POR, WDT DMA, POR, WDT
Product Status Discontinued at Digi-Key Active Active
RoHS Compliant Compliant Compliant
Price $0.00 $0.00 $0.00
Availability In Stock In Stock In Stock

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