MC68HCP11E1FU vs MC68HCP11E1CP3 vs MC68HCP11E0FNE

Same silicon die in different packages — compare I/O count, footprint, and form factor to find the best fit for your PCB design.

Parameter MC68HCP11E1FU Current MC68HCP11E1CP3 MC68HCP11E0FNE
Core Processor HC11 M68HC11 HC11
Speed 3MHz 3MHz 3MHz
RAM Size 512 x 8 512 x 8 512 x 8
Number of I/O 38 16 38
Package / Case 52-LCC (J-Lead) 48-DIP (0.600\ 52-LCC (J-Lead)
Operating Temperature 0°C ~ 70°C (TA) -40°C ~ 85°C (TA) 0°C ~ 70°C (TA)
Peripherals POR, WDT POR, WDT POR, WDT
Connectivity SCI, SPI SCI, SPI SCI, SPI
Product Status Active Active Active
Price $9.88 $9.42 $19.53
Availability In Stock In Stock In Stock

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