MC68HCP11E1CP3 vs MC68HCP11E0FNE vs MC68HCP11E1FU

Same silicon die in different packages — compare I/O count, footprint, and form factor to find the best fit for your PCB design.

Parameter MC68HCP11E1CP3 Current MC68HCP11E0FNE MC68HCP11E1FU
Core Processor M68HC11 HC11 HC11
Speed 3MHz 3MHz 3MHz
RAM Size 512 x 8 512 x 8 512 x 8
Number of I/O 16 38 38
Package / Case 48-DIP (0.600\ 52-LCC (J-Lead) 52-LCC (J-Lead)
Operating Temperature -40°C ~ 85°C (TA) 0°C ~ 70°C (TA) 0°C ~ 70°C (TA)
Peripherals POR, WDT POR, WDT POR, WDT
Connectivity SCI, SPI SCI, SPI SCI, SPI
Product Status Active Active Active
Price $9.42 $19.53 $9.88
Availability In Stock In Stock In Stock

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