XCZU9CG-2FFVB1156E vs XCZU9CG-1FFVC900E vs XCZU9CG-1FFVC900I

Same silicon die in different packages — compare I/O count, footprint, and form factor to find the best fit for your PCB design.

Parameter XCZU9CG-2FFVB1156E Current XCZU9CG-1FFVC900E XCZU9CG-1FFVC900I
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Speed 533MHz, 1.3GHz 500MHz, 1.2GHz 500MHz, 1.2GHz
Architecture MCU, FPGA MCU, FPGA MCU, FPGA
RAM Size 256KB 256KB 256KB
Package / Case 1156-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA
Operating Temperature 0°C ~ 100°C (TJ) 0°C ~ 100°C (TJ) -40°C ~ 100°C (TJ)
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals DMA, WDT DMA, WDT DMA, WDT
Product Status Active Active Active
RoHS Compliant Compliant Compliant
Price $4,613.75 $2,916.25 $3,645.00
Availability In Stock In Stock In Stock

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