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XCV600-4BG560I–FPGA, 15552 Logic Elements, 560-LBGA Exposed Pad | AMD
● Obsolete The XCV600-4BG560I is a fpga from AMD, in 560-LBGA Exposed Pad package. Specified operating temperature:...
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Description
x● Obsolete
The XCV600-4BG560I is a fpga from AMD, in 560-LBGA Exposed Pad package. Specified operating temperature: -40°C ~ 100°C (TJ).
📋 Key Specifications
- Number of Logic Elements/Cells:15552
- Number of LABs/CLBs:3456
- Total RAM Bits:98304
- Number of I/O:404
- Package / Case:560-LBGA Exposed Pad, Metal
- Operating Temperature:-40°C ~ 100°C (TJ)
- Voltage - Supply:2.375V ~ 2.625V
🎯 Typical Applications
- High-speed digital signal processing (typical for this category)
- Hardware acceleration applications
- Video and image processing systems
- Prototyping and hardware emulation
- Custom digital logic implementation
❓ FAQ
What is the specified operating temperature range for XCV600-4BG560I?
According to the specifications, the XCV600-4BG560I is rated for operation from -40°C ~ 100°C (TJ).
What package is the XCV600-4BG560I available in?
The XCV600-4BG560I is offered in 560-LBGA Exposed Pad package format.
How many logic elements does the XCV600-4BG560I have?
The XCV600-4BG560I contains 15552 logic elements/cells.
Where can I find detailed specifications for XCV600-4BG560I?
The complete datasheet with detailed specifications is available for download above.
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Specifications
x| Number of Logic Elements/Cells | 15552 |
|---|---|
| Number of LABs/CLBs | 3456 |
| Total RAM Bits | 98304 |
| Number of I/O | 404 |
| Package / Case | 560-LBGA Exposed Pad, Metal |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Voltage - Supply | 2.375V ~ 2.625V |
| Product Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Mounting Type | Surface Mount |
| Number of Gates | 661111 |
| Package | Tray |
| Supplier Device Package | 560-MBGA (42.5x42.5) |
Datasheet
xXCV600-4BG560I Datasheet
Official datasheet from AMD with complete electrical specifications, application circuits, and package information.
Download PDF DatasheetSource: AMD • Format: PDF
XCV600-4BG560I vs XCV600-4BG560C vs XCV600-4BG432I
Same silicon die in different packages — compare I/O count, footprint, and form factor to find the best fit for your PCB design.
| Parameter | XCV600-4BG560I Current | XCV600-4BG560C | XCV600-4BG432I |
|---|---|---|---|
| Number of Logic Elements/Cells | 15552 | 15552 | 15552 |
| Number of LABs/CLBs | 3456 | 3456 | 3456 |
| Total RAM Bits | 98304 | 98304 | 98304 |
| Number of I/O | 404 | 404 | 316 |
| Package / Case | 560-LBGA Exposed Pad, Metal | 560-LBGA Exposed Pad, Metal | 432-LBGA Exposed Pad, Metal |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
| Voltage - Supply | 2.375V ~ 2.625V | 2.375V ~ 2.625V | 2.375V ~ 2.625V |
| Product Status | Obsolete | Obsolete | Obsolete |
| Price | $0.00 | $0.00 | $0.00 |
| Availability | In Stock | In Stock | In Stock |
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