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XCV1000E-6FG900C–FPGA, 27648 Logic Elements, 900-BBGA | AMD
● Obsolete The XCV1000E-6FG900C is a fpga from AMD, in 900-BBGA package. Specified operating temperature: 0°C ~...
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Description
x● Obsolete
The XCV1000E-6FG900C is a fpga from AMD, in 900-BBGA package. Specified operating temperature: 0°C ~ 85°C (TJ).
📋 Key Specifications
- Number of Logic Elements/Cells:27648
- Number of LABs/CLBs:6144
- Total RAM Bits:393216
- Number of I/O:660
- Package / Case:900-BBGA
- Operating Temperature:0°C ~ 85°C (TJ)
- Voltage - Supply:1.71V ~ 1.89V
🎯 Typical Applications
- High-speed digital signal processing (typical for this category)
- Hardware acceleration applications
- Video and image processing systems
- Prototyping and hardware emulation
- Custom digital logic implementation
❓ FAQ
What is the specified operating temperature range for XCV1000E-6FG900C?
According to the specifications, the XCV1000E-6FG900C is rated for operation from 0°C ~ 85°C (TJ).
What package is the XCV1000E-6FG900C available in?
The XCV1000E-6FG900C is offered in 900-BBGA package format.
How many logic elements does the XCV1000E-6FG900C have?
The XCV1000E-6FG900C contains 27648 logic elements/cells.
Where can I find detailed specifications for XCV1000E-6FG900C?
The complete datasheet with detailed specifications is available for download above.
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Specifications
x| Number of Logic Elements/Cells | 27648 |
|---|---|
| Number of LABs/CLBs | 6144 |
| Total RAM Bits | 393216 |
| Number of I/O | 660 |
| Package / Case | 900-BBGA |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Voltage - Supply | 1.71V ~ 1.89V |
| Product Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Mounting Type | Surface Mount |
| Number of Gates | 1569178 |
| Package | Tray |
| Supplier Device Package | 900-FBGA (31x31) |
Datasheet
xXCV1000E-6FG900C Datasheet
Official datasheet from AMD with complete electrical specifications, application circuits, and package information.
Download PDF DatasheetSource: AMD • Format: PDF
XCV1000E-6FG900C vs XCV1000E-6FG680I vs XCV1000E-6FG900C
Same silicon die in different packages — compare I/O count, footprint, and form factor to find the best fit for your PCB design.
| Parameter | XCV1000E-6FG900C Current | XCV1000E-6FG680I | XCV1000E-6FG900C |
|---|---|---|---|
| Number of Logic Elements/Cells | 27648 | 27648 | 27648 |
| Number of LABs/CLBs | 6144 | 6144 | 6144 |
| Total RAM Bits | 393216 | 393216 | 393216 |
| Number of I/O | 660 | 512 | 660 |
| Package / Case | 900-BBGA | 680-LBGA Exposed Pad | 900-BBGA |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
| Voltage - Supply | 1.71V ~ 1.89V | 1.71V ~ 1.89V | 1.71V ~ 1.89V |
| Product Status | Obsolete | Obsolete | Obsolete |
| Price | $0.00 | $0.00 | $0.00 |
| Availability | In Stock | In Stock | In Stock |
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