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XCV100-4BG256I–FPGA, 2700 Logic Elements, 256-BBGA | AMD
● Obsolete The XCV100-4BG256I is a fpga from AMD, in 256-BBGA package. Specified operating temperature: -40°C ~...
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Description
x● Obsolete
The XCV100-4BG256I is a fpga from AMD, in 256-BBGA package. Specified operating temperature: -40°C ~ 100°C (TJ).
📋 Key Specifications
- Number of Logic Elements/Cells:2700
- Number of LABs/CLBs:600
- Total RAM Bits:40960
- Number of I/O:180
- Package / Case:256-BBGA
- Operating Temperature:-40°C ~ 100°C (TJ)
- Voltage - Supply:2.375V ~ 2.625V
🎯 Typical Applications
- High-speed digital signal processing (typical for this category)
- Hardware acceleration applications
- Video and image processing systems
- Prototyping and hardware emulation
- Custom digital logic implementation
❓ FAQ
What is the specified operating temperature range for XCV100-4BG256I?
According to the specifications, the XCV100-4BG256I is rated for operation from -40°C ~ 100°C (TJ).
What package is the XCV100-4BG256I available in?
The XCV100-4BG256I is offered in 256-BBGA package format.
How many logic elements does the XCV100-4BG256I have?
The XCV100-4BG256I contains 2700 logic elements/cells.
Where can I find detailed specifications for XCV100-4BG256I?
The complete datasheet with detailed specifications is available for download above.
💡 Need Pricing?
Contact us for stock status and volume pricing.
Specifications
x| Number of Logic Elements/Cells | 2700 |
|---|---|
| Number of LABs/CLBs | 600 |
| Total RAM Bits | 40960 |
| Number of I/O | 180 |
| Package / Case | 256-BBGA |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Voltage - Supply | 2.375V ~ 2.625V |
| Product Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Mounting Type | Surface Mount |
| Number of Gates | 108904 |
| Package | Tray |
| Supplier Device Package | 256-PBGA (27x27) |
Datasheet
xXCV100-4BG256I Datasheet
Official datasheet from AMD with complete electrical specifications, application circuits, and package information.
Download PDF DatasheetSource: AMD • Format: PDF
XCV100-4BG256I vs XCV100-4BG256I vs XCV100-4BG256C
Same silicon die in different packages — compare I/O count, footprint, and form factor to find the best fit for your PCB design.
| Parameter | XCV100-4BG256I Current | XCV100-4BG256I | XCV100-4BG256C |
|---|---|---|---|
| Number of Logic Elements/Cells | 2700 | 2700 | 2700 |
| Number of LABs/CLBs | 600 | 600 | 600 |
| Total RAM Bits | 40960 | 40960 | 40960 |
| Number of I/O | 180 | 180 | 180 |
| Package / Case | 256-BBGA | 256-BBGA | 256-BBGA |
| Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
| Voltage - Supply | 2.375V ~ 2.625V | 2.375V ~ 2.625V | 2.375V ~ 2.625V |
| Product Status | Obsolete | Obsolete | Obsolete |
| Price | $0.00 | $0.00 | $0.00 |
| Availability | In Stock | In Stock | In Stock |
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