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XCKU3P-3FFVA676E–FPGA, 355950 Logic Elements, 676-BBGA | AMD
✓ RoHS● Active The XCKU3P-3FFVA676E is a fpga from AMD, in 676-BBGA package. Specified operating temperature: 0°C...
- $2,615.00
- $2,615.00
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Description
x
✓ RoHS● Active
The XCKU3P-3FFVA676E is a fpga from AMD, in 676-BBGA package. Specified operating temperature: 0°C ~ 100°C (TJ).
📋 Key Specifications
- Number of Logic Elements/Cells:355950
- Number of LABs/CLBs:20340
- Total RAM Bits:31641600
- Number of I/O:256
- Package / Case:676-BBGA, FCBGA
- Operating Temperature:0°C ~ 100°C (TJ)
- Voltage - Supply:0.873V ~ 0.927V
🎯 Typical Applications
- High-speed digital signal processing (typical for this category)
- Hardware acceleration applications
- Video and image processing systems
- Prototyping and hardware emulation
- Custom digital logic implementation
❓ FAQ
What is the specified operating temperature range for XCKU3P-3FFVA676E?
According to the specifications, the XCKU3P-3FFVA676E is rated for operation from 0°C ~ 100°C (TJ).
What package is the XCKU3P-3FFVA676E available in?
The XCKU3P-3FFVA676E is offered in 676-BBGA package format.
How many logic elements does the XCKU3P-3FFVA676E have?
The XCKU3P-3FFVA676E contains 355950 logic elements/cells.
Is the XCKU3P-3FFVA676E RoHS compliant?
Yes, the XCKU3P-3FFVA676E is listed as RoHS compliant.
Where can I find detailed specifications for XCKU3P-3FFVA676E?
The complete datasheet with detailed specifications is available for download above.
💡 Need Pricing?
Contact us for stock status and volume pricing.
Specifications
x| Number of Logic Elements/Cells | 355950 |
|---|---|
| Number of LABs/CLBs | 20340 |
| Total RAM Bits | 31641600 |
| Number of I/O | 256 |
| Package / Case | 676-BBGA, FCBGA |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Voltage - Supply | 0.873V ~ 0.927V |
| Product Status | Active |
| DigiKey Programmable | Not Verified |
| Mounting Type | Surface Mount |
| Package | Tray |
| Supplier Device Package | 676-FCBGA (27x27) |
Tier Pricing
xVolume Pricing
💡 Custom Pricing Available:
For quantities exceeding 10,000 units or special requirements, please contact our sales team for a customized quote.
Datasheet
xXCKU3P-3FFVA676E Datasheet
Official datasheet from AMD with complete electrical specifications, application circuits, and package information.
Download PDF DatasheetSource: AMD • Format: PDF
XCKU3P-3FFVA676E vs XCKU3P-1FFVD900E vs XCKU3P-1FFVD900I
Same silicon die in different packages — compare I/O count, footprint, and form factor to find the best fit for your PCB design.
| Parameter | XCKU3P-3FFVA676E Current | XCKU3P-1FFVD900E | XCKU3P-1FFVD900I |
|---|---|---|---|
| Number of Logic Elements/Cells | 355950 | 355950 | 355950 |
| Number of LABs/CLBs | 20340 | 20340 | 20340 |
| Total RAM Bits | 31641600 | 31641600 | 31641600 |
| Number of I/O | 256 | 304 | 304 |
| Package / Case | 676-BBGA, FCBGA | 900-BBGA, FCBGA | 900-BBGA, FCBGA |
| Operating Temperature | 0°C ~ 100°C (TJ) | 0°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) |
| Voltage - Supply | 0.873V ~ 0.927V | 0.825V ~ 0.876V | 0.825V ~ 0.876V |
| Product Status | Active | Active | Active |
| RoHS | Compliant | Compliant | Compliant |
| Price | $2,615.00 | $1,558.75 | $1,948.75 |
| Availability | In Stock | In Stock | In Stock |
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