XCKU3P-2FFVD900E
XCKU3P-2FFVD900E

XCKU3P-2FFVD900E–FPGA, 355950 Logic Elements, 900-BBGA | AMD

✓ RoHS● Active The XCKU3P-2FFVD900E is a fpga from AMD, in 900-BBGA package. Specified operating temperature: 0°C...
Vendor: AMD
SKU: 7219010
Availability: Many In Stock
Product type: FPGA
$2,182.50
$2,182.50
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Subtotal: $2,182.50
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XCKU3P-2FFVD900E

XCKU3P-2FFVD900E–FPGA, 355950 Logic Elements, 900-BBGA | AMD

$2,182.50
XCKU3P-2FFVD900E

XCKU3P-2FFVD900E–FPGA, 355950 Logic Elements, 900-BBGA | AMD

$2,182.50
Description
Description
x
✓ RoHS● Active

The XCKU3P-2FFVD900E is a fpga from AMD, in 900-BBGA package. Specified operating temperature: 0°C ~ 100°C (TJ).

📋 Key Specifications

  • Number of Logic Elements/Cells:355950
  • Number of LABs/CLBs:20340
  • Total RAM Bits:31641600
  • Number of I/O:304
  • Package / Case:900-BBGA, FCBGA
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Voltage - Supply:0.825V ~ 0.876V

🎯 Typical Applications

  • High-speed digital signal processing (typical for this category)
  • Hardware acceleration applications
  • Video and image processing systems
  • Prototyping and hardware emulation
  • Custom digital logic implementation

❓ FAQ

What is the specified operating temperature range for XCKU3P-2FFVD900E?
According to the specifications, the XCKU3P-2FFVD900E is rated for operation from 0°C ~ 100°C (TJ).
What package is the XCKU3P-2FFVD900E available in?
The XCKU3P-2FFVD900E is offered in 900-BBGA package format.
How many logic elements does the XCKU3P-2FFVD900E have?
The XCKU3P-2FFVD900E contains 355950 logic elements/cells.
Is the XCKU3P-2FFVD900E RoHS compliant?
Yes, the XCKU3P-2FFVD900E is listed as RoHS compliant.
Where can I find detailed specifications for XCKU3P-2FFVD900E?
The complete datasheet with detailed specifications is available for download above.

💡 Need Pricing?

Contact us for stock status and volume pricing.

Specifications
Specifications
x
Number of Logic Elements/Cells355950
Number of LABs/CLBs20340
Total RAM Bits31641600
Number of I/O304
Package / Case900-BBGA, FCBGA
Operating Temperature0°C ~ 100°C (TJ)
Voltage - Supply0.825V ~ 0.876V
Product StatusActive
DigiKey ProgrammableNot Verified
Mounting TypeSurface Mount
PackageTray
Supplier Device Package900-FCBGA (31x31)
Read more
Tier Pricing
Tier Pricing
x

Volume Pricing

Quantity Unit Price (USD) Extended Price Savings
1+$2,182.50$2,182.50-
3+$2,073.38$6,220.125% OFF
10+$1,920.60$19,206.0012% OFF
25+$1,789.65$44,741.2518% OFF
💡 Custom Pricing Available: For quantities exceeding 10,000 units or special requirements, please contact our sales team for a customized quote.
Datasheet
Datasheet
x

XCKU3P-2FFVD900E Datasheet

Official datasheet from AMD with complete electrical specifications, application circuits, and package information.

Download PDF Datasheet

Source: AMD • Format: PDF

XCKU3P-2FFVD900E vs XCKU3P-1FFVA676E vs XCKU3P-1FFVB676E

Same silicon die in different packages — compare I/O count, footprint, and form factor to find the best fit for your PCB design.

Parameter XCKU3P-2FFVD900E Current XCKU3P-1FFVA676E XCKU3P-1FFVB676E
Number of Logic Elements/Cells 355950 355950 355950
Number of LABs/CLBs 20340 20340 20340
Total RAM Bits 31641600 31641600 31641600
Number of I/O 304 256 280
Package / Case 900-BBGA, FCBGA 676-BBGA, FCBGA 676-BBGA, FCBGA
Operating Temperature 0°C ~ 100°C (TJ) 0°C ~ 100°C (TJ) 0°C ~ 100°C (TJ)
Voltage - Supply 0.825V ~ 0.876V 0.825V ~ 0.876V 0.825V ~ 0.876V
Product Status Active Active Active
RoHS Compliant Compliant Compliant
Price $2,182.50 $1,452.50 $1,516.25
Availability In Stock In Stock In Stock
View XCKU3P-2FFVD900E View XCKU3P-1FFVA676E View XCKU3P-1FFVB676E

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