XC7Z045-3FBG676E vs XC7Z045-1FFG900C vs XC7Z045-1FFG900CES

Same silicon die in different packages — compare I/O count, footprint, and form factor to find the best fit for your PCB design.

Parameter XC7Z045-3FBG676E Current XC7Z045-1FFG900C XC7Z045-1FFG900CES
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Speed 1GHz 667MHz 667MHz
Architecture MCU, FPGA MCU, FPGA MCU, FPGA
RAM Size 256KB 256KB 256KB
Package / Case 676-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA
Operating Temperature 0°C ~ 100°C (TJ) 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals DMA DMA DMA
Product Status Active Active Obsolete
RoHS Compliant Compliant
Price $2,383.75 $2,070.00 $1,468.55
Availability In Stock In Stock In Stock

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