XC7Z030-2FBG676I vs XC7Z030-1FB484I vs XC7Z030-1FBG484C

Same silicon die in different packages — compare I/O count, footprint, and form factor to find the best fit for your PCB design.

Parameter XC7Z030-2FBG676I Current XC7Z030-1FB484I XC7Z030-1FBG484C
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Speed 800MHz 667MHz 667MHz
Architecture MCU, FPGA MCU, FPGA MCU, FPGA
RAM Size 256KB 256KB 256KB
Package / Case 676-BBGA, FCBGA 484-BBGA, FCBGA 484-BBGA, FCBGA
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ)
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals DMA DMA DMA
Product Status Active Active Active
RoHS Compliant Compliant
Price $432.50 $408.20 $261.25
Availability In Stock In Stock In Stock

Related Products

Recently Viewed Products