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XC6SLX9-N3FT256C–FPGA, 9152 Logic Elements, 256-LBGA | AMD
● Obsolete The XC6SLX9-N3FT256C is a fpga from AMD, in 256-LBGA package. Specified operating temperature: 0°C ~...
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Description
x● Obsolete
The XC6SLX9-N3FT256C is a fpga from AMD, in 256-LBGA package. Specified operating temperature: 0°C ~ 85°C (TJ).
📋 Key Specifications
- Number of Logic Elements/Cells:9152
- Number of LABs/CLBs:715
- Total RAM Bits:589824
- Number of I/O:186
- Package / Case:256-LBGA
- Operating Temperature:0°C ~ 85°C (TJ)
- Voltage - Supply:1.14V ~ 1.26V
🎯 Typical Applications
- High-speed digital signal processing (typical for this category)
- Hardware acceleration applications
- Video and image processing systems
- Prototyping and hardware emulation
- Custom digital logic implementation
❓ FAQ
What is the specified operating temperature range for XC6SLX9-N3FT256C?
According to the specifications, the XC6SLX9-N3FT256C is rated for operation from 0°C ~ 85°C (TJ).
What package is the XC6SLX9-N3FT256C available in?
The XC6SLX9-N3FT256C is offered in 256-LBGA package format.
How many logic elements does the XC6SLX9-N3FT256C have?
The XC6SLX9-N3FT256C contains 9152 logic elements/cells.
Where can I find detailed specifications for XC6SLX9-N3FT256C?
The complete datasheet with detailed specifications is available for download above.
💡 Need Pricing?
Contact us for stock status and volume pricing.
Specifications
x| Number of Logic Elements/Cells | 9152 |
|---|---|
| Number of LABs/CLBs | 715 |
| Total RAM Bits | 589824 |
| Number of I/O | 186 |
| Package / Case | 256-LBGA |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Voltage - Supply | 1.14V ~ 1.26V |
| Product Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Mounting Type | Surface Mount |
| Package | Tray |
| Supplier Device Package | 256-FTBGA (17x17) |
Tier Pricing
xVolume Pricing
💡 Custom Pricing Available:
For quantities exceeding 10,000 units or special requirements, please contact our sales team for a customized quote.
Datasheet
xXC6SLX9-N3FT256C Datasheet
Official datasheet from AMD with complete electrical specifications, application circuits, and package information.
Download PDF DatasheetSource: AMD • Format: PDF
XC6SLX9-N3FT256C vs XC6SLX9-2CPG196C vs XC6SLX9-2CPG196C
Same silicon die in different packages — compare I/O count, footprint, and form factor to find the best fit for your PCB design.
| Parameter | XC6SLX9-N3FT256C Current | XC6SLX9-2CPG196C | XC6SLX9-2CPG196C |
|---|---|---|---|
| Number of Logic Elements/Cells | 9152 | 9152 | 9152 |
| Number of LABs/CLBs | 715 | 715 | 715 |
| Total RAM Bits | 589824 | 589824 | 589824 |
| Number of I/O | 186 | 106 | 106 |
| Package / Case | 256-LBGA | 196-TFBGA, CSBGA | 196-TFBGA, CSBGA |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
| Voltage - Supply | 1.14V ~ 1.26V | 1.14V ~ 1.26V | 1.14V ~ 1.26V |
| Product Status | Obsolete | Active | Active |
| Price | $28.62 | $33.81 | $33.81 |
| Availability | In Stock | In Stock | In Stock |
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