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XC6SLX25-3FG484C–FPGA, 24051 Logic Elements, 484-BBGA | AMD
● Active The XC6SLX25-3FG484C is a fpga from AMD, in 484-BBGA package. Specified operating temperature: 0°C ~...
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Description
x● Active
The XC6SLX25-3FG484C is a fpga from AMD, in 484-BBGA package. Specified operating temperature: 0°C ~ 85°C (TJ).
📋 Key Specifications
- Number of Logic Elements/Cells:24051
- Number of LABs/CLBs:1879
- Total RAM Bits:958464
- Number of I/O:266
- Package / Case:484-BBGA
- Operating Temperature:0°C ~ 85°C (TJ)
- Voltage - Supply:1.14V ~ 1.26V
🎯 Typical Applications
- High-speed digital signal processing (typical for this category)
- Hardware acceleration applications
- Video and image processing systems
- Prototyping and hardware emulation
- Custom digital logic implementation
❓ FAQ
What is the specified operating temperature range for XC6SLX25-3FG484C?
According to the specifications, the XC6SLX25-3FG484C is rated for operation from 0°C ~ 85°C (TJ).
What package is the XC6SLX25-3FG484C available in?
The XC6SLX25-3FG484C is offered in 484-BBGA package format.
How many logic elements does the XC6SLX25-3FG484C have?
The XC6SLX25-3FG484C contains 24051 logic elements/cells.
Where can I find detailed specifications for XC6SLX25-3FG484C?
The complete datasheet with detailed specifications is available for download above.
💡 Need Pricing?
Contact us for stock status and volume pricing.
Specifications
x| Number of Logic Elements/Cells | 24051 |
|---|---|
| Number of LABs/CLBs | 1879 |
| Total RAM Bits | 958464 |
| Number of I/O | 266 |
| Package / Case | 484-BBGA |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Voltage - Supply | 1.14V ~ 1.26V |
| Product Status | Active |
| DigiKey Programmable | Not Verified |
| Mounting Type | Surface Mount |
| Package | Tray |
| Supplier Device Package | 484-FBGA (23x23) |
Tier Pricing
xVolume Pricing
💡 Custom Pricing Available:
For quantities exceeding 10,000 units or special requirements, please contact our sales team for a customized quote.
Datasheet
xXC6SLX25-3FG484C Datasheet
Official datasheet from AMD with complete electrical specifications, application circuits, and package information.
Download PDF DatasheetSource: AMD • Format: PDF
XC6SLX25-3FG484C vs XC6SLX25-2CSG324C vs XC6SLX25-2CSG324I
Same silicon die in different packages — compare I/O count, footprint, and form factor to find the best fit for your PCB design.
| Parameter | XC6SLX25-3FG484C Current | XC6SLX25-2CSG324C | XC6SLX25-2CSG324I |
|---|---|---|---|
| Number of Logic Elements/Cells | 24051 | 24051 | 24051 |
| Number of LABs/CLBs | 1879 | 1879 | 1879 |
| Total RAM Bits | 958464 | 958464 | 958464 |
| Number of I/O | 266 | 226 | 226 |
| Package / Case | 484-BBGA | 324-LFBGA, CSPBGA | 324-LFBGA, CSPBGA |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
| Voltage - Supply | 1.14V ~ 1.26V | 1.14V ~ 1.26V | 1.14V ~ 1.26V |
| Product Status | Active | Active | Active |
| Price | $122.92 | $80.43 | $92.54 |
| Availability | In Stock | In Stock | In Stock |
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