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XC3S250E-4PQG208I–FPGA, 5508 Logic Elements, 208-BFQFP | AMD
✓ RoHS● Obsolete The XC3S250E-4PQG208I is a fpga from AMD, in 208-BFQFP package. Specified operating temperature: -40°C...
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Description
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✓ RoHS● Obsolete
The XC3S250E-4PQG208I is a fpga from AMD, in 208-BFQFP package. Specified operating temperature: -40°C ~ 100°C (TJ).
📋 Key Specifications
- Number of Logic Elements/Cells:5508
- Number of LABs/CLBs:612
- Total RAM Bits:221184
- Number of I/O:158
- Package / Case:208-BFQFP
- Operating Temperature:-40°C ~ 100°C (TJ)
- Voltage - Supply:1.14V ~ 1.26V
🎯 Typical Applications
- High-speed digital signal processing (typical for this category)
- Hardware acceleration applications
- Video and image processing systems
- Prototyping and hardware emulation
- Custom digital logic implementation
❓ FAQ
What is the specified operating temperature range for XC3S250E-4PQG208I?
According to the specifications, the XC3S250E-4PQG208I is rated for operation from -40°C ~ 100°C (TJ).
What package is the XC3S250E-4PQG208I available in?
The XC3S250E-4PQG208I is offered in 208-BFQFP package format.
How many logic elements does the XC3S250E-4PQG208I have?
The XC3S250E-4PQG208I contains 5508 logic elements/cells.
Is the XC3S250E-4PQG208I RoHS compliant?
Yes, the XC3S250E-4PQG208I is listed as RoHS compliant.
Where can I find detailed specifications for XC3S250E-4PQG208I?
The complete datasheet with detailed specifications is available for download above.
💡 Need Pricing?
Contact us for stock status and volume pricing.
Specifications
x| Number of Logic Elements/Cells | 5508 |
|---|---|
| Number of LABs/CLBs | 612 |
| Total RAM Bits | 221184 |
| Number of I/O | 158 |
| Package / Case | 208-BFQFP |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Voltage - Supply | 1.14V ~ 1.26V |
| Product Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Mounting Type | Surface Mount |
| Number of Gates | 250000 |
| Package | Tray |
| Supplier Device Package | 208-PQFP (28x28) |
Datasheet
xXC3S250E-4PQG208I Datasheet
Official datasheet from AMD with complete electrical specifications, application circuits, and package information.
Download PDF DatasheetSource: AMD • Format: PDF
XC3S250E-4PQG208I vs XC3S250E-4PQG208C vs XC3S250E-4PQ208I
Same silicon die in different packages — compare I/O count, footprint, and form factor to find the best fit for your PCB design.
| Parameter | XC3S250E-4PQG208I Current | XC3S250E-4PQG208C | XC3S250E-4PQ208I |
|---|---|---|---|
| Number of Logic Elements/Cells | 5508 | 5508 | 5508 |
| Number of LABs/CLBs | 612 | 612 | 612 |
| Total RAM Bits | 221184 | 221184 | 221184 |
| Number of I/O | 158 | 158 | 158 |
| Package / Case | 208-BFQFP | 208-BFQFP | 208-BFQFP |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
| Voltage - Supply | 1.14V ~ 1.26V | 1.14V ~ 1.26V | 1.14V ~ 1.26V |
| Product Status | Obsolete | Obsolete | Obsolete |
| RoHS | Compliant | Compliant | — |
| Price | $0.00 | $256.25 | $0.00 |
| Availability | In Stock | In Stock | In Stock |
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