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XC3S250E-4FTG256I–FPGA, 5508 Logic Elements, 256-LBGA | AMD
✓ RoHS● Obsolete The XC3S250E-4FTG256I is a fpga from AMD, in 256-LBGA package. Specified operating temperature: -40°C...
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Description
x
✓ RoHS● Obsolete
The XC3S250E-4FTG256I is a fpga from AMD, in 256-LBGA package. Specified operating temperature: -40°C ~ 100°C (TJ).
📋 Key Specifications
- Number of Logic Elements/Cells:5508
- Number of LABs/CLBs:612
- Total RAM Bits:221184
- Number of I/O:172
- Package / Case:256-LBGA
- Operating Temperature:-40°C ~ 100°C (TJ)
- Voltage - Supply:1.14V ~ 1.26V
🎯 Typical Applications
- High-speed digital signal processing (typical for this category)
- Hardware acceleration applications
- Video and image processing systems
- Prototyping and hardware emulation
- Custom digital logic implementation
❓ FAQ
What is the specified operating temperature range for XC3S250E-4FTG256I?
According to the specifications, the XC3S250E-4FTG256I is rated for operation from -40°C ~ 100°C (TJ).
What package is the XC3S250E-4FTG256I available in?
The XC3S250E-4FTG256I is offered in 256-LBGA package format.
How many logic elements does the XC3S250E-4FTG256I have?
The XC3S250E-4FTG256I contains 5508 logic elements/cells.
Is the XC3S250E-4FTG256I RoHS compliant?
Yes, the XC3S250E-4FTG256I is listed as RoHS compliant.
Where can I find detailed specifications for XC3S250E-4FTG256I?
The complete datasheet with detailed specifications is available for download above.
💡 Need Pricing?
Contact us for stock status and volume pricing.
Specifications
x| Number of Logic Elements/Cells | 5508 |
|---|---|
| Number of LABs/CLBs | 612 |
| Total RAM Bits | 221184 |
| Number of I/O | 172 |
| Package / Case | 256-LBGA |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Voltage - Supply | 1.14V ~ 1.26V |
| Product Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Mounting Type | Surface Mount |
| Number of Gates | 250000 |
| Package | Tray |
| Supplier Device Package | 256-FTBGA (17x17) |
Tier Pricing
xVolume Pricing
💡 Custom Pricing Available:
For quantities exceeding 10,000 units or special requirements, please contact our sales team for a customized quote.
Datasheet
xXC3S250E-4FTG256I Datasheet
Official datasheet from AMD with complete electrical specifications, application circuits, and package information.
Download PDF DatasheetSource: AMD • Format: PDF
XC3S250E-4FTG256I vs XC3S250E-4FTG256C vs XC3S250E-4FT256I
Same silicon die in different packages — compare I/O count, footprint, and form factor to find the best fit for your PCB design.
| Parameter | XC3S250E-4FTG256I Current | XC3S250E-4FTG256C | XC3S250E-4FT256I |
|---|---|---|---|
| Number of Logic Elements/Cells | 5508 | 5508 | 5508 |
| Number of LABs/CLBs | 612 | 612 | 612 |
| Total RAM Bits | 221184 | 221184 | 221184 |
| Number of I/O | 172 | 172 | 172 |
| Package / Case | 256-LBGA | 256-LBGA | 256-LBGA |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
| Voltage - Supply | 1.14V ~ 1.26V | 1.14V ~ 1.26V | 1.14V ~ 1.26V |
| Product Status | Obsolete | Obsolete | Obsolete |
| RoHS | Compliant | Compliant | — |
| Price | $74.75 | $0.00 | $109.83 |
| Availability | In Stock | In Stock | In Stock |
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