MC68HC705P6ACP vs MC68HC705L5FUE vs MC68HC705SR3CP

Same silicon die in different packages — compare I/O count, footprint, and form factor to find the best fit for your PCB design.

Parameter MC68HC705P6ACP Current MC68HC705L5FUE MC68HC705SR3CP
Core Processor HC05 HC05 HC05
Speed 2.1MHz 2.1MHz 4MHz
Program Memory Size 4.5KB (4.5K x 8) 8KB (8K x 8) 3.75KB (3.75K x 8)
RAM Size 176 x 8 256 x 8 192 x 8
Number of I/O 21 16 32
Package / Case 28-DIP (0.600\ 80-QFP 40-DIP (0.600\
Operating Temperature -40°C ~ 85°C (TA) 0°C ~ 70°C (TA) -40°C ~ 85°C (TA)
Peripherals POR, WDT LCD, POR, WDT LED, POR
Connectivity SIO SPI
Product Status Obsolete Obsolete Obsolete
Price $4.16 $0.00 $14.18
Availability In Stock In Stock In Stock

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