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MC68HC11E1VFNE3–Microcontroller, HC11 @ 3MHz, 52-LCC (J-Lead) | NXP USA Inc.
✓ RoHS● Obsolete The MC68HC11E1VFNE3 is a microcontroller from NXP USA Inc., featuring HC11 running at 3MHz,...
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Description
x
✓ RoHS● Obsolete
The MC68HC11E1VFNE3 is a microcontroller from NXP USA Inc., featuring HC11 running at 3MHz, in 52-LCC (J-Lead) package. Specified operating temperature: -40°C ~ 105°C (TA).
📋 Key Specifications
- Core Processor:HC11
- Speed:3MHz
- RAM Size:512 x 8
- Number of I/O:38
- Package / Case:52-LCC (J-Lead)
- Operating Temperature:-40°C ~ 105°C (TA)
- Peripherals:POR, WDT
🎯 Typical Applications
- Embedded control systems (typical for this category)
- IoT sensor nodes and endpoints
- Motor control applications
- Human-machine interfaces (HMI)
- Consumer electronics
❓ FAQ
What is the specified operating temperature range for MC68HC11E1VFNE3?
According to the specifications, the MC68HC11E1VFNE3 is rated for operation from -40°C ~ 105°C (TA).
What package is the MC68HC11E1VFNE3 available in?
The MC68HC11E1VFNE3 is offered in 52-LCC (J-Lead) package format.
What processor is integrated in the MC68HC11E1VFNE3?
The MC68HC11E1VFNE3 integrates HC11 processor.
Is the MC68HC11E1VFNE3 RoHS compliant?
Yes, the MC68HC11E1VFNE3 is listed as RoHS compliant.
Where can I find detailed specifications for MC68HC11E1VFNE3?
The complete datasheet with detailed specifications is available for download above.
💡 Need Pricing?
Contact us for stock status and volume pricing.
Specifications
x| Core Processor | HC11 |
|---|---|
| Speed | 3MHz |
| RAM Size | 512 x 8 |
| Number of I/O | 38 |
| Package / Case | 52-LCC (J-Lead) |
| Operating Temperature | -40°C ~ 105°C (TA) |
| Peripherals | POR, WDT |
| Connectivity | SCI, SPI |
| Product Status | Obsolete |
| Core Size | 8-Bit |
| Data Converters | A/D 8x8b |
| DigiKey Programmable | Not Verified |
| EEPROM Size | 512 x 8 |
| Mounting Type | Surface Mount |
| Oscillator Type | Internal |
| Package | Tube |
| Program Memory Type | ROMless |
| Supplier Device Package | 52-PLCC (19.1x19.1) |
| Voltage - Supply (Vcc/Vdd) | 4.5V ~ 5.5V |
Tier Pricing
xVolume Pricing
💡 Custom Pricing Available:
For quantities exceeding 10,000 units or special requirements, please contact our sales team for a customized quote.
Datasheet
xMC68HC11E1VFNE3 Datasheet
Official datasheet from NXP USA Inc. with complete electrical specifications, application circuits, and package information.
Download PDF DatasheetSource: NXP USA Inc. • Format: PDF
MC68HC11E1VFNE3 vs MC68HC11E1MFNE3 vs MC68HC11E1CFNE3
Same silicon die in different packages — compare I/O count, footprint, and form factor to find the best fit for your PCB design.
| Parameter | MC68HC11E1VFNE3 Current | MC68HC11E1MFNE3 | MC68HC11E1CFNE3 |
|---|---|---|---|
| Core Processor | HC11 | HC11 | HC11 |
| Speed | 3MHz | 3MHz | 3MHz |
| RAM Size | 512 x 8 | 512 x 8 | 512 x 8 |
| Number of I/O | 38 | 38 | 38 |
| Package / Case | 52-LCC (J-Lead) | 52-LCC (J-Lead) | 52-LCC (J-Lead) |
| Operating Temperature | -40°C ~ 105°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 85°C (TA) |
| Peripherals | POR, WDT | POR, WDT | POR, WDT |
| Connectivity | SCI, SPI | SCI, SPI | SCI, SPI |
| Product Status | Obsolete | Obsolete | Obsolete |
| RoHS | Compliant | Compliant | Compliant |
| Price | $10.63 | $0.00 | $0.00 |
| Availability | In Stock | In Stock | In Stock |
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