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LFSCM3GA25EP1-6FN900C–FPGA, 25000 Logic Elements, 900-BBGA | Lattice Semiconductor Corporation
✓ RoHS● Obsolete The LFSCM3GA25EP1-6FN900C is a fpga from Lattice Semiconductor Corporation, in 900-BBGA package. Specified operating...
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2752186
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FPGA
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Description
x
✓ RoHS● Obsolete
The LFSCM3GA25EP1-6FN900C is a fpga from Lattice Semiconductor Corporation, in 900-BBGA package. Specified operating temperature: 0°C ~ 85°C (TJ).
📋 Key Specifications
- Number of Logic Elements/Cells:25000
- Number of LABs/CLBs:6250
- Total RAM Bits:1966080
- Number of I/O:378
- Package / Case:900-BBGA
- Operating Temperature:0°C ~ 85°C (TJ)
- Voltage - Supply:0.95V ~ 1.26V
🎯 Typical Applications
- High-speed digital signal processing (typical for this category)
- Hardware acceleration applications
- Video and image processing systems
- Prototyping and hardware emulation
- Custom digital logic implementation
❓ FAQ
What is the specified operating temperature range for LFSCM3GA25EP1-6FN900C?
According to the specifications, the LFSCM3GA25EP1-6FN900C is rated for operation from 0°C ~ 85°C (TJ).
What package is the LFSCM3GA25EP1-6FN900C available in?
The LFSCM3GA25EP1-6FN900C is offered in 900-BBGA package format.
How many logic elements does the LFSCM3GA25EP1-6FN900C have?
The LFSCM3GA25EP1-6FN900C contains 25000 logic elements/cells.
Is the LFSCM3GA25EP1-6FN900C RoHS compliant?
Yes, the LFSCM3GA25EP1-6FN900C is listed as RoHS compliant.
Where can I find detailed specifications for LFSCM3GA25EP1-6FN900C?
The complete datasheet with detailed specifications is available for download above.
💡 Need Pricing?
Contact us for stock status and volume pricing.
Specifications
x| Number of Logic Elements/Cells | 25000 |
|---|---|
| Number of LABs/CLBs | 6250 |
| Total RAM Bits | 1966080 |
| Number of I/O | 378 |
| Package / Case | 900-BBGA |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Voltage - Supply | 0.95V ~ 1.26V |
| Product Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Mounting Type | Surface Mount |
| Package | Tray |
| Supplier Device Package | 900-FPBGA (31x31) |
Datasheet
xLFSCM3GA25EP1-6FN900C Datasheet
Official datasheet from Lattice Semiconductor Corporation with complete electrical specifications, application circuits, and package information.
Download PDF DatasheetSource: Lattice Semiconductor Corporation • Format: PDF
LFSCM3GA25EP1-6FN900C vs LFSCM3GA25EP1-6F900I vs LFSCM3GA25EP1-6FN900I
Same silicon die in different packages — compare I/O count, footprint, and form factor to find the best fit for your PCB design.
| Parameter | LFSCM3GA25EP1-6FN900C Current | LFSCM3GA25EP1-6F900I | LFSCM3GA25EP1-6FN900I |
|---|---|---|---|
| Number of Logic Elements/Cells | 25000 | 25000 | 25000 |
| Number of LABs/CLBs | 6250 | 6250 | 6250 |
| Total RAM Bits | 1966080 | 1966080 | 1966080 |
| Number of I/O | 378 | 378 | 378 |
| Package / Case | 900-BBGA | 900-BBGA | 900-BBGA |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 105°C (TJ) | -40°C ~ 105°C (TJ) |
| Voltage - Supply | 0.95V ~ 1.26V | 0.95V ~ 1.26V | 0.95V ~ 1.26V |
| Product Status | Obsolete | Obsolete | Obsolete |
| RoHS | Compliant | — | Compliant |
| Price | $0.00 | $0.00 | $0.00 |
| Availability | In Stock | In Stock | In Stock |
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