LFSCM3GA15EP1-6FN256C vs LFSCM3GA15EP1-6F900C vs LFSCM3GA15EP1-6FN900C

Same silicon die in different packages — compare I/O count, footprint, and form factor to find the best fit for your PCB design.

Parameter LFSCM3GA15EP1-6FN256C Current LFSCM3GA15EP1-6F900C LFSCM3GA15EP1-6FN900C
Number of Logic Elements/Cells 15000 15000 15000
Number of LABs/CLBs 3750 3750 3750
Total RAM Bits 1054720 1054720 1054720
Number of I/O 139 300 300
Package / Case 256-BGA 900-BBGA 900-BBGA
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Voltage - Supply 0.95V ~ 1.26V 0.95V ~ 1.26V 0.95V ~ 1.26V
Product Status Obsolete Obsolete Obsolete
RoHS Compliant Compliant
Price $0.00 $0.00 $0.00
Availability In Stock In Stock In Stock

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