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Microsemi (Microchip)

Microsemi (Microchip) is a leading semiconductor manufacturer whose components are widely used in industrial, automotive, telecommunications, and consumer el...

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Microsemi (Microchip)

Microsemi (Microchip)

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  • FPGA - 5962-9322101MXA–FPGA, 132-BCPGA | Microsemi Corpor
    Microsemi Corporation

    5962-9322101MXA–FPGA, 132-BCPGA | Microsemi Corporation

    ● Obsolete The 5962-9322101MXA is a fpga from Microsemi Corporation, in 132-BCPGA package. Specified operating temperature: -55°C ~ 125°C (TJ). 📋 Key Specifications Number of LABs/CLBs:684 Number of I/O:104 Package / Case:132-BCPGA Operating Temperature:-55°C ~ 125°C (TJ) Voltage - Supply:4.5V ~ 5.5V 🎯 Typical...
    $2,222.25
    $2,222.25
  • FPGA - 5962-9958602QXC–FPGA, 256-BFCQFP Exposed Pad and T
    Microsemi Corporation

    5962-9958602QXC–FPGA, 256-BFCQFP Exposed Pad and Tie Bar | Microsemi Corporation

    ● Obsolete The 5962-9958602QXC is a fpga from Microsemi Corporation, in 256-BFCQFP Exposed Pad and Tie Bar package. Specified operating temperature: -55°C ~ 125°C (TJ). 📋 Key Specifications Number of LABs/CLBs:2880 Number of I/O:203 Package / Case:256-BFCQFP Exposed Pad and Tie Bar Operating Temperature:-55°C...
    $9,777.29
    $9,777.29
  • FPGA - 5962-9958601QXC–FPGA, 256-BFCQFP Exposed Pad and T
    Microsemi Corporation

    5962-9958601QXC–FPGA, 256-BFCQFP Exposed Pad and Tie Bar | Microsemi Corporation

    ● Obsolete The 5962-9958601QXC is a fpga from Microsemi Corporation, in 256-BFCQFP Exposed Pad and Tie Bar package. Specified operating temperature: -55°C ~ 125°C (TJ). 📋 Key Specifications Number of LABs/CLBs:2880 Number of I/O:203 Package / Case:256-BFCQFP Exposed Pad and Tie Bar Operating Temperature:-55°C...
    $8,148.88
    $8,148.88
  • FPGA - 5962-9956904QYC–FPGA, 208-BFCQFP with Tie Bar | Mi
    Microsemi Corporation

    5962-9956904QYC–FPGA, 208-BFCQFP with Tie Bar | Microsemi Corporation

    ● Obsolete The 5962-9956904QYC is a fpga from Microsemi Corporation, in 208-BFCQFP with Tie Bar package. Specified operating temperature: -55°C ~ 125°C (TJ). 📋 Key Specifications Number of LABs/CLBs:1452 Number of I/O:175 Package / Case:208-BFCQFP with Tie Bar Operating Temperature:-55°C ~ 125°C (TJ) Voltage...
    $4,727.85
    $4,727.85
  • FPGA - 5962-9956904QXC–FPGA, 256-BFCQFP Exposed Pad and T
    Microsemi Corporation

    5962-9956904QXC–FPGA, 256-BFCQFP Exposed Pad and Tie Bar | Microsemi Corporation

    ● Obsolete The 5962-9956904QXC is a fpga from Microsemi Corporation, in 256-BFCQFP Exposed Pad and Tie Bar package. Specified operating temperature: -55°C ~ 125°C (TJ). 📋 Key Specifications Number of LABs/CLBs:1452 Number of I/O:180 Package / Case:256-BFCQFP Exposed Pad and Tie Bar Operating Temperature:-55°C...
    $5,432.69
    $5,432.69
  • FPGA - MPF300XT-1FCG484I–FPGA, 300000 Logic Elements, 484
    Microsemi Corporation

    MPF300XT-1FCG484I–FPGA, 300000 Logic Elements, 484-BBGA | Microsemi Corporation

    ● Obsolete The MPF300XT-1FCG484I is a fpga from Microsemi Corporation, in 484-BBGA package. Specified operating temperature: -40°C ~ 100°C (TJ). 📋 Key Specifications Number of Logic Elements/Cells:300000 Total RAM Bits:21094400 Number of I/O:244 Package / Case:484-BBGA Operating Temperature:-40°C ~ 100°C (TJ) Voltage - Supply:0.97V...
    $416.95
    $416.95
  • FPGA - MPF300XT-1FCG484E–FPGA, 300000 Logic Elements, 484
    Microsemi Corporation

    MPF300XT-1FCG484E–FPGA, 300000 Logic Elements, 484-BBGA | Microsemi Corporation

    ● Active The MPF300XT-1FCG484E is a fpga from Microsemi Corporation, in 484-BBGA package. Specified operating temperature: 0°C ~ 100°C (TJ). 📋 Key Specifications Number of Logic Elements/Cells:300000 Total RAM Bits:21094400 Number of I/O:244 Package / Case:484-BBGA Operating Temperature:0°C ~ 100°C (TJ) Voltage - Supply:0.97V...
    $0.00
    $0.00
  • M7AFS600-PQG208I
    Microsemi Corporation

    M7AFS600-PQG208I–FPGA, 208-BFQFP | Microsemi Corporation

    ● Obsolete The M7AFS600-PQG208I is a fpga from Microsemi Corporation, in 208-BFQFP package. Specified operating temperature: -40°C ~ 85°C (TA). 📋 Key Specifications Total RAM Bits:110592 Number of I/O:95 Package / Case:208-BFQFP Operating Temperature:-40°C ~ 85°C (TA) Voltage - Supply:1.425V ~ 1.575V 🎯 Typical...
    $0.00
    $0.00
  • M7AFS600-PQG208
    Microsemi Corporation

    M7AFS600-PQG208–FPGA, 208-BFQFP | Microsemi Corporation

    ● Obsolete The M7AFS600-PQG208 is a fpga from Microsemi Corporation, in 208-BFQFP package. Specified operating temperature: 0°C ~ 70°C (TA). 📋 Key Specifications Total RAM Bits:110592 Number of I/O:95 Package / Case:208-BFQFP Operating Temperature:0°C ~ 70°C (TA) Voltage - Supply:1.425V ~ 1.575V 🎯 Typical...
    $0.00
    $0.00
  • M7AFS600-PQ208I
    Microsemi Corporation

    M7AFS600-PQ208I–FPGA, 208-BFQFP | Microsemi Corporation

    ● Obsolete The M7AFS600-PQ208I is a fpga from Microsemi Corporation, in 208-BFQFP package. Specified operating temperature: -40°C ~ 85°C (TA). 📋 Key Specifications Total RAM Bits:110592 Number of I/O:95 Package / Case:208-BFQFP Operating Temperature:-40°C ~ 85°C (TA) Voltage - Supply:1.425V ~ 1.575V 🎯 Typical...
    $0.00
    $0.00
  • M7AFS600-2PQG208
    Microsemi Corporation

    M7AFS600-2PQG208–FPGA, 208-BFQFP | Microsemi Corporation

    ● Obsolete The M7AFS600-2PQG208 is a fpga from Microsemi Corporation, in 208-BFQFP package. Specified operating temperature: 0°C ~ 70°C (TA). 📋 Key Specifications Total RAM Bits:110592 Number of I/O:95 Package / Case:208-BFQFP Operating Temperature:0°C ~ 70°C (TA) Voltage - Supply:1.425V ~ 1.575V 🎯 Typical...
    $0.00
    $0.00
  • M7AFS600-2PQ208I
    Microsemi Corporation

    M7AFS600-2PQ208I–FPGA, 208-BFQFP | Microsemi Corporation

    ● Obsolete The M7AFS600-2PQ208I is a fpga from Microsemi Corporation, in 208-BFQFP package. Specified operating temperature: -40°C ~ 85°C (TA). 📋 Key Specifications Total RAM Bits:110592 Number of I/O:95 Package / Case:208-BFQFP Operating Temperature:-40°C ~ 85°C (TA) Voltage - Supply:1.425V ~ 1.575V 🎯 Typical...
    $0.00
    $0.00
  • M7AFS600-2PQ208
    Microsemi Corporation

    M7AFS600-2PQ208–FPGA, 208-BFQFP | Microsemi Corporation

    ● Obsolete The M7AFS600-2PQ208 is a fpga from Microsemi Corporation, in 208-BFQFP package. Specified operating temperature: 0°C ~ 70°C (TA). 📋 Key Specifications Total RAM Bits:110592 Number of I/O:95 Package / Case:208-BFQFP Operating Temperature:0°C ~ 70°C (TA) Voltage - Supply:1.425V ~ 1.575V 🎯 Typical...
    $0.00
    $0.00
  • M7AFS600-1PQG208I
    Microsemi Corporation

    M7AFS600-1PQG208I–FPGA, 208-BFQFP | Microsemi Corporation

    ● Obsolete The M7AFS600-1PQG208I is a fpga from Microsemi Corporation, in 208-BFQFP package. Specified operating temperature: -40°C ~ 85°C (TA). 📋 Key Specifications Total RAM Bits:110592 Number of I/O:95 Package / Case:208-BFQFP Operating Temperature:-40°C ~ 85°C (TA) Voltage - Supply:1.425V ~ 1.575V 🎯 Typical...
    $0.00
    $0.00
  • M7AFS600-1PQ208I
    Microsemi Corporation

    M7AFS600-1PQ208I–FPGA, 208-BFQFP | Microsemi Corporation

    ● Obsolete The M7AFS600-1PQ208I is a fpga from Microsemi Corporation, in 208-BFQFP package. Specified operating temperature: -40°C ~ 85°C (TA). 📋 Key Specifications Total RAM Bits:110592 Number of I/O:95 Package / Case:208-BFQFP Operating Temperature:-40°C ~ 85°C (TA) Voltage - Supply:1.425V ~ 1.575V 🎯 Typical...
    $0.00
    $0.00
  • M2S010S-1VFG400I
    Microsemi Corporation

    M2S010S-1VFG400I–SoC, ARM® Cortex®-M3 @ 166MHz, 400-LFBGA | Microsemi Corporation

    ● Obsolete The M2S010S-1VFG400I is a soc from Microsemi Corporation, featuring ARM® Cortex®-M3 running at 166MHz, in 400-LFBGA package. Specified operating temperature: -40°C ~ 100°C (TJ). 📋 Key Specifications Core Processor:ARM® Cortex®-M3 Speed:166MHz Architecture:MCU, FPGA RAM Size:64KB Package / Case:400-LFBGA Operating Temperature:-40°C ~ 100°C...
    $51.88
    $51.88
  • M2S010S-1VF400I
    Microsemi Corporation

    M2S010S-1VF400I–SoC, ARM® Cortex®-M3 @ 166MHz, 400-LFBGA | Microsemi Corporation

    ● Obsolete The M2S010S-1VF400I is a soc from Microsemi Corporation, featuring ARM® Cortex®-M3 running at 166MHz, in 400-LFBGA package. Specified operating temperature: -40°C ~ 100°C (TJ). 📋 Key Specifications Core Processor:ARM® Cortex®-M3 Speed:166MHz Architecture:MCU, FPGA RAM Size:64KB Package / Case:400-LFBGA Operating Temperature:-40°C ~ 100°C...
    $51.88
    $51.88
  • M2S010S-1FGG484I
    Microsemi Corporation

    M2S010S-1FGG484I–SoC, ARM® Cortex®-M3 @ 166MHz, 484-BGA | Microsemi Corporation

    ● Obsolete The M2S010S-1FGG484I is a soc from Microsemi Corporation, featuring ARM® Cortex®-M3 running at 166MHz, in 484-BGA package. Specified operating temperature: -40°C ~ 100°C (TJ). 📋 Key Specifications Core Processor:ARM® Cortex®-M3 Speed:166MHz Architecture:MCU, FPGA RAM Size:64KB Package / Case:484-BGA Operating Temperature:-40°C ~ 100°C...
    $53.34
    $53.34
  • M2S010S-1FG484I
    Microsemi Corporation

    M2S010S-1FG484I–SoC, ARM® Cortex®-M3 @ 166MHz, 484-BGA | Microsemi Corporation

    ● Obsolete The M2S010S-1FG484I is a soc from Microsemi Corporation, featuring ARM® Cortex®-M3 running at 166MHz, in 484-BGA package. Specified operating temperature: -40°C ~ 100°C (TJ). 📋 Key Specifications Core Processor:ARM® Cortex®-M3 Speed:166MHz Architecture:MCU, FPGA RAM Size:64KB Package / Case:484-BGA Operating Temperature:-40°C ~ 100°C...
    $53.34
    $53.34
  • M2GL050T-1FGG484X417
    Microsemi Corporation

    M2GL050T-1FGG484X417–FPGA, 56340 Logic Elements, 484-BGA | Microsemi Corporation

    ● Obsolete The M2GL050T-1FGG484X417 is a fpga from Microsemi Corporation, in 484-BGA package. Specified operating temperature: 0°C ~ 85°C (TJ). 📋 Key Specifications Number of Logic Elements/Cells:56340 Total RAM Bits:1869824 Number of I/O:267 Package / Case:484-BGA Operating Temperature:0°C ~ 85°C (TJ) Voltage - Supply:1.14V...
    $82.79
    $82.79

Frequently Asked Questions

How does WWD Parts verify the authenticity of Microsemi (Microchip) components?
Every Microsemi (Microchip) component undergoes rigorous inspection following AS6081 and IDEA-STD-1010 standards. We provide full traceability documentation including certificates of conformance, date codes, and lot tracking for each shipment.
Does WWD Parts offer volume pricing for Microsemi (Microchip) parts?
Yes. Submit your BOM or contact our sales team for competitive volume pricing on Microsemi (Microchip) components. We offer project-based quotes with flexible MOQ options and same-day response.
What is the typical lead time for Microsemi (Microchip) components?
Lead times vary by part number and availability. In-stock items ship same day. For allocated or long-lead items, we leverage our global sourcing network to find the fastest available supply.
Can I get compliance documentation for Microsemi (Microchip) products?
Yes. We provide RoHS certificates, REACH declarations, certificates of conformance, and full traceability records for all Microsemi (Microchip) components upon request.
How do I submit a BOM inquiry for Microsemi (Microchip) parts?
Upload your BOM on our Request Quote page or email it to our sales team. You will receive a detailed quote with pricing, availability, and lead times for each Microsemi (Microchip) line item within 24 hours.

Microsemi (Microchip) is a leading semiconductor manufacturer whose components are widely used in industrial, automotive, telecommunications, and consumer electronics applications. WWD Parts provides verified Microsemi (Microchip) components with full traceability documentation, competitive pricing, and same-day shipping for in-stock items.

• Full range of Microsemi (Microchip) components verified to AS6081 and IDEA-STD-1010 standards

• Same-day shipping available for in-stock parts across all product lines

• Volume pricing and BOM support for production quantities

• Complete compliance documentation (RoHS, REACH, CoC) available on request

• Global sourcing network for hard-to-find and allocated components

Selection Tips

→ Start with the Microsemi (Microchip) product selector guide to narrow down by application and performance requirements

→ Check lifecycle status before committing to a new design — prefer Active or Recommended for New Designs parts

→ Verify temperature grade and package availability early in the design cycle to avoid supply issues

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